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Three-dimensional FPGAs

4/28/2011

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We have a blog post today from  Ze'ev Wurman, the Chief Software Architect of MonolithIC 3D Inc. Ze'ev spent many years leading EDA/software work at Dynachip, eASIC and Amdahl. In today's post, he explores vertical integration in the world of FPGAs.


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Si2 to form 3-D IC standards group

4/26/2011

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Interesting bit in EETimes about a new effort to develop standards for 3D IC development.

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Yield and the 3D IC

4/26/2011

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Semiconductor Manufacturing & Design has a very interesting discussion of the ways that die stacking will impact final product yields.

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EETimes: Sematech adds Six Companies to its 3-D team

4/25/2011

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According to the report in EETimes, the group of companies contributing to the  3-D enablement program at SEMATECH has just grown by six.

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Looking beyond lithography

4/25/2011

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For the past 40 years, semiconductor technologists relied on improvements in lithography to "cram more components onto integrated circuits". Toshiba, Samsung and other non-volatile memory companies are betting the future will be different. Let's look at the fascinating idea they're pursuing...

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EDA Cafe Interviews Riko Radojcic on 3D Standards

4/22/2011

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From what I hear at meetings, Qualcomm is one of the companies really driving towards production of 3D chips/packages.  Of course, it makes perfect sense given their commitment to the mobile market, with its attendant constraints on power and footprint combined demands for significantly better system performance.

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Impact of TSVs on Thermal Management

4/22/2011

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Dr. Garrou has an excellent post that includes a segment on work at Penn State and IBM on the ways that dense TSVs can impact thermal management.

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Obtaining Monocrystalline Semiconductor Layers for Monolithic 3D

4/22/2011

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We have a guest contribution today from Israel Beinglass, the CTO of MonolithIC 3D Inc. Israel was an executive at Applied Materials for many years, and is considered one of the leading industry experts in epi technology. He served as a board member at SiGen in the late 1990s (for those who are not familiar with SiGen, it was one of the first companies that worked on ion-cut technology). In this post, Israel discusses and compares different techniques to obtain stacked monocrystalline semiconductor layers.


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Cost Advantages will Drive 3-D System ICs

4/21/2011

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The DAC Blog has a very nice report on Dr. Walden Rhines' discussion of 3D ICs at the recent GlobalPress event.  The post presents more details than I've seen in other reports.  If you're interested in seeing what one of the true EDA luminaries is thinking about 3D, go read this post...

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CEA-Leti moves toward 3D chip production in Europe

4/20/2011

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Electronics Weekly has an interesting story about a pile of EV Group (EVG) equipment going in to a 300mm line at CEA-Leti.

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