"EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available on the company’s industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion and hybrid wafer bonding, the SmartView NT3 aligner provides sub-50-nm wafer-to-wafer alignment accuracy — a 2-3X improvement — as well as significantly higher throughput (up to 20 wafers per hour) compared to the previous-generation platform." - Solid State Technology Magazine
For over 4 decades the gap between computer processing speed and memory access has grown at about 50% per year, to more than 1,000x today. This provides an excellent opportunity to enhance the single-core system performance. An innovative 3D integration technology combined with re-architecting the integrated memory device is proposed to bridge the gap and enable a 1,000 x improvement in computer systems. The proposed technology utilizes processes that are widely available and could be integrated in products within a very short time.
A Game Changer for Monolithic 3D - monolithic 3D IC without the need for a new recipe for transistor formation. The process could be adapted by any current fab providing very competitive costs offering for long term road map for better offerings
Monolithic 3D: The Most Effective Path for Future IC Scaling
A technology breakthrough allows the fabrication of semiconductor devices with multiple tiers of copper connected active devices utilizing conventional fab equipment. MonolithIC 3D Inc. offers solutions for logic and memory technologies, with significant benefits for cost, power and operating speed. The company believes in collaboration with existing players in the semiconductor industry.