Monolithic 3D Inc., the Next Generation 3D-IC Company


Monolithic 3D-IC is Finally Practical

  A technology breakthrough allows the fabrication of semiconductor devices with multiple tiers of copper connected active devices utilizing conventional  fab equipment. MonolithIC 3D Inc. offers solutions for logic and memory technologies, with significant benefits for cost, power and operating speed. The company believes in collaboration with existing players in the semiconductor industry.

   News

In The News

  • The Why and How of Fine-Grain 3D Integration

    • Industry Expert Blogs sharing our blog post about Fine-Grain 3D Integration.

  • Is 3D IC Packaging Ready For Prime Time?

    • Press coverage about our technology in Electronic Design Magazine on December 28, 2011.

  • Overview of Monolithic 3D Integration solutions for 3D flash memories

    • Press coverage about our monolithic 3d flash memories in I-Micronews on December 13th, 2011.

  • MonolithIC 3D Issued 5th Patent on 3D IC Technology

    • Our press release was covered in Euroasia Semiconductor Magazine in December, 2011.

  • Do Foundries Have Too Much Power?

    • Our blog post was covered by the Design and Reuse on December 12th, 2011.

  • 3D Thursday: Is 2.5D IC assembly “buzz-worthy”?

    • Our blog post was covered by the EDA360 Insider blog.

  • Is the Buzz around Xilinx's 2.5D FPGA Justified?

    • Press coverage about our latest blog post.

  • What can 20MW Exascale computers teach us about SoC Realization?

    • Steve Leibson's article on our blog post about "The Dally-nVIDIA-Stanford Prescription for Exascale Computing".

  • 3D chips: The next electronics revolution

    • Press coverage about our VP of Technology, Brian Cronquist in Computerworld on Novemeber 2, 2011.

  • Perspectives on Low Temperature Wafer Direct Bonding for Monolithic 3D Integration

    • Our blog post was covered by Semiconductor Packaging News on October 27th, 2011.

  • Perfecting the 3-D chip

    • Press coverage about Zvi Or-Bach, CEO of MonolithIC 3D Inc.

  • The real cost in the move to 450mm wafers

    • Electronics News's article on our blog post about 450nm wafers.

  • How to Create American Jobs

    • The Huffington Post's article about Zvi Or Bach, CEO at MonolithIC 3D Inc.

  • Interconnect Power II

    • Chip Design Magazine's article based on our blog post on analyzing Intel's 22 nm FinFET technology versus a hypothetical planar 22nm CMOS technology.

  • Can 450nm Decommoditize the Semiconductor Industry?

    • Industry Expert Blogs sharing our blog post about 450nm wafers.

  • Overcoming direct source-drain tunnelling limitations for CMOS transistors

    • Electronics News Australia's cover story of the magazine about our blog post.

  • Viewpoint: What lies ahead for on-chip interconnect technology?

    • EETimes published our blog post.

  • Future Horizons forum focuses on 'new rules'

    • EE Times article about The International Electronics Forum. Among the forum's speakers there is Zvi Or-Bach, CEO MonolithIC 3D.

  • 3D ICs without TSVs?

    • Electronic Design News (EDN)'s article about the ion cutting process

  • MonolithIC 3D Inc. Advocates Talent-based Recovery of the US Economy

    • San Francisco Chronicle's article about our press release.

  • MonolithIC 3D Inc. Voices Concern that K-12 Science Framework Produces Technology Consumers, Not Technology Creators

    • San Francisco Chronicle's article on our press release.

  • Viewpoint: Will tri-gate play key role in Intel-ARM tussle?

    • EE Times article about our viewpoint for fabricating three-dimensional ICs which differs from Intel's tri-gate technology.

  • 3D Thursday: The most expensive RAM in the world

    • EDA 360's writeup on our company's monolithically stacked SRAM ideas.

  • MonolithIC 3D - Best of West Finalist Suggests Scaling "Up" with 3D

    • Semicon West Daily's article on our company.

       Events

    International 3D System Integration Conference
    January 31st - February 2, 2012 | Osaka, Japan

    Join MonolithIC 3D Inc. at an invited talk at the International 3D System Integration Conference on February 1st, 2012 in Osaka, Japan. Deepak Sekar, MonolithIC 3D's Chief Scientist and Zvi Or-Bach, president and CEO of MonolithIC 3D Inc. will talk about "Monolithic 3D-ICs with Single Crystal Silicon Layers". 

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