Others work relevant to monolithic 3D IC

• Transistors Will Stop Shrinking in 2021, Moore’s Law Roadmap Predicts, By Rachel Courtland, July 22, 2016.
  
• Leti Extends Collaboration With Qualcomm On CoolCube 3D Integration Technology, April 12, 2016
• Stanford-led skyscraper-style chip design boosts electronic performance by factor of a thousand, Stanford Report, December 9, 2015.
• Moore's Law at 50: Are we planning for retirement?, IEDM Conference,Plenary talk: Greg Yeric, ARM Research Fellow, December 7, 2015.
• "Silicon Wafer Bonding Technology for VLSI and MEMS applications", The ELTRAN (SOI-Epi WaferTM) Technology, Takao Yonehara.
• Monolithic 3D processing using non-equilibrium RTP, By Ed Korczynski, Senior Technical Editor, Solid State Technology, April 17, 2015.
• From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges, Oliver Billoint, LETI, 2015.
• 3D VLSI: Next Generation 3D Integration Technology, by Karim Arabi, VP of Qualcomm, at 2015 ISPD.
• 3D Qualcomm SoCs by 2016, EE Times Article by R. Colin Johnson, March 31st, 2015.
• Memory leads the way to better computing, H.-S. Philip Wong and Sayeef Salahuddin, March 17th, 2015.
• 3D stacking offers an extension for Moore's Law, E&T Magazine by Chris Edwards, February 16th, 2015.
• Leti Devices Workshop, Leti San Francisco, December 14th, 2014.
• True 3-D Chip Harness Nanotubes, EE Times Article by R. Colin Johnson, December 19th, 2014.
• Novel Low Temperature 3D Wafer Stacking Technology for High Density Device Integration, by Dr. Ionut Radu, Soitec, Bucharest 2013.
• Going Up! Monolithic 3D As An Alternative to CMOS Scaling, by  Jean-Eric Michallet, Hughes Metras and Perrine Batude (CEA-Leti), April 9th, 2014.
• Rise of the Monolithic 3D Chip, IEEE Spectrum, February 24th, 2014.
• CMOS technologies: Our most power efficient solution today and our vision toward 10nm node and beyond, Leti Devices Workshop, December 8, 2013
• High-Density Integration of Functional Modules Using Monolithic 3D-IC Technology, Dept. of Electrical and Computer Engineering, Georgia Tech, Atlanta GA, USA and Qualcomm Research, San Diego, CA, USA
• Low Power Design, Past and Future (monolithic 3D), By Bob Brodersen (UCB), Anantha Chandrakasan (MIT) and Dejan Markovic (UCLA).
• Cramming more components onto integrated circuits, By Gordon E. Moore.
• Monolithic 3D chip fabricated without TSVs, Solid State Technology blog post. 
• New 3D Approaches: Enabling Technologies for Nanoelectronic Devices, Soitec at CEA-LETI 15thAnnual Review 
• 3D-IC Integration (CMP 3D IC presentation)
• Helping Flash Memory Grow Up: Etch Technology For The Terabit Era (The Applied Materials Blog)
• CMP 3D-IC Integration (Cirsuit's Multi Projects Webpage) .
• Monolithic 3D-ICs with single grain Si thin film transistors (Solid State Electronics An International Journal)
• Cost Efficient Wafer-Level Stacking Technologies (Chip Scale Review - Digital Edition - January - February 2013, pg. 26-30)
• Building block for wafer-level 3D Integration (Solid State Technology Magazine)
• Michio Kaku: Tweaking Moore’s Law (Video)

   Papers and Presentations

• Modified ELTRAN® - A Game Changer for Monolithic 3D, Zvi Or-Bach, Brian Cronquist, Zeev Wurman, Israel Beinglass, and Albert K. Henning, October 2015.
• MonolithIC 3D – The Most Effective Path for Future IC Scaling, MonolithIC 3D Inc., October 2015.
• CHIPS 2020 VOL. 2: New Vistas in Nanoelectronics - Chapter "Monolithic 3D Integration", page 51-91, Zvi Or-Bach, October 2015.
• "Monolithic 3D Advantage", Free E-book, November 2014.
• Precision Bonders - A Game Changer for Monolithic 3D, IEEE S3S 2014, October 2014. 
• Monolithic 3D Integrated Circuits, NCCAVS Joint User Group Meeting, June 12, 2014
• A disruptor to the semiconductor industry The Monolithic 3D IC, ITHERM 2014, May 2014.
• Monolithic 3D Integrated Circuits - Zvi Or-Bach Technion Lecture, Israel, March 2014 (video lecture). 
• "Der Ausweg aus dem Skalierungs-Dilemma?", Electronic Information, Germany, January 2014. 
• "THE MONOLITHIC 3D-IC", Slide Presentation at the 2013 S3S Conference, October 2013.
• "Practical Process Flows for Monolithic 3D", 3D Plenary Talk held at the 2013 S3S Conference, October 2013.
• "The Monolithic 3D Advantage", Tutorial presented at the 2013 IEEE 3DIC Conference, October 2013.
• "Thermal Considerations for Monolithic Integration of Three-Dimensional Integrated Circuits", Poster presented at the 2013 S3S Conference, October 2013.
• "Pulsed Laser Annealing: A scalable and practical technology for monolithic 3D IC", Paper presented at the 2013 IEEE 3DIC Conference, October 2013.
• "MonolithIC 3D™ - the Future of Semiconductor Scaling", Presentation at Semicon West 2013 - SIF, July 2013.
• "Monolithic 3D Memory - NAND Flash, DRAM and R-RAM", Free E-book, March 2013.
• "Monolithic 3D - In General", Free E-book, March 2013.
• "Monolithic 3D Advantage", Free E-book, February 2013
• "The Monolithic 3D Advantage", Paper, January 2013
• "Cooling Three-Dimensional Integrated Circuits using Power Delivery Networks", Paper at the IEDM Conference, Dec 2012 (paper) (slides).
• "Monolithic 3D Integrated Circuits", Guest Lecture at Technion City, January 1st, 2013
• "The First Step to Take When You Consider Taking Your Scientific Breakthrough to Startup", Guest Lecture at Technion City, January 1st, 2013
• MonolithIC 3D-ICs RCAT, HKMG , RCJLT  and 3D Embedded eDRAM Approach, MonolithIC 3D Inc., Free E-book, December 2012
• "The Short, Medium and Long-Term Path to the 3D Ecosystem", Panel Discussion at EDPS, April 5th, 2012 
• "Monolithic 3D-ICs with Single Crystal Silicon Layers", Invited paper at the IEEE 3DIC conference, 2012 (paper) (slides) 
• "Fine-Grained 3D Integration", Invited talk at the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, January 11, 2012
• "Monolithic 3D - The effective alternative to Dimensional Scaling", Invited lecture at the Technion - Israel Institute of Technology, November 21, 2011
• "3D: Where are we today; Where are we going; and How will you get there with us?", Invited talk at the 9th International System-on-Chip (SoC) Conference, Exhibit & Workshops in Southern California, November 2-3, 2011
• "Monolithic 3D-ICs: The Effective Alternative to Dimensional Scaling", Invited keynote speech at the Intl. Electronics Forum in Seville, October 7, 2011
• "Resistive RAM: Technology and Market Applications", Invited Talk at the University of California, Berkeley, September 2011
• "Monolithic 3D Integrated Circuits", Invited Talk at Intel Research (Photonics Technology Lab), July 2011
• "Monolithic 3D Integrated Circuits", Invited Talk at the CMOS Emerging Technologies Workshop, June 2011
• "Monolithic 3D DRAM Technology", Invited Talk at the American Vacuum Society Workshop on 3D Packaging, June 2011
• "The Monolithic 3D-IC", Invited Talk at the 3D Workshop at the Intl. Conference on Technology & Instrumentation in Particle Physics, June 2011
• "Monolithic 3D FPGAs", Invited Talk at the Intl. Memory Workshop, May 2011
• "Monolithic 3D Integrated Circuits", Invited Talk at the Technical University of Munich, May 2011
• "Monolithic 3D Integrated Circuits", appears in Issue #37 of Future-Fab International, April 2011
• "Monolithic 3D Technology: Nu3D-IC, A Semiconductor Industry Game Changer", Invited Presentation at the 3D-ASIP Conference, Dec 2010.

• "Resistive RAM: Technology and Market Applications", Invited Presentation at the IEEE-SCV Electron Devices Society, Nov 2010.

• "3D-FPGA: The Path to ASIC-like Density, Power and Performance", Invited Presentation at the Applied Materials 3D Interconnect Symposium, Jan 2010.

   Patents

    Only issued patents are listed below. We have 50+ patents pending at the US Patent Office.

1. US Patent 9,419,031 Semiconductor and optoelectronic devices, Issued August 16th, 2016.
2. US Patent 9,412,645 Semiconductor devices and structures, Issued August 9th, 2016.
3. US Patent 9,406,670 System comprising a semiconductor device and structure, Issued August 2nd, 2016.
4. US Patent 9,385,088 3D semiconductor device and structure, Issued July 5th, 2016.
5. US Patent 9,385,058 Semiconductor device and structure, Issued July 5th, 2016.
6. US Patent 9,318,408 Semiconductor device and structure, Issued April 19th, 2016.
7. US Patent 9,305,867 Semiconductor devices and structures, Issued April 5th, 2016.
8. US Patent 9,299,641 Semiconductor system, device and structure with heat removal, Issued March 29th, 2016.
9. US Patent 9,275,723 Scalable floating body memory cell for memory compilers and method of using floating body memories with memory compilers, Issued Mar 1, 2016
10. US Patent 9,252,134 Semiconductor device and structure, Issued February 2nd, 2016.
11. US Patent 9,236,382 Method of maintaining the state of semiconductor memory having electrically floating body transistor, Issued January 12th, 2016.
12. US Patent 9,219,005 Semiconductor system and device, Issued December 22nd, 2015.
13. US Patent 9,197,804 Semiconductor and optoelectronic devices, Issued November 24th, 2015.
14. US Patent 9,142,553 Semiconductor device and structure, Issued on September 22nd, 2015. 
15. US Patent 9,136,153 3D semiconductor device and structure with back-bias, Issued on September 15th, 2015.
16. US Patent 9,117,749 Semiconductor device and structure, Issued on August 25th, 2015.
17. US Patent 9,099,526 Integrated circuit device and structure, Issued on August 4th, 2015.
18. US Patent 9,099,424 Semiconductor system, device and structure with heat removal, Issued on August 4th, 2015.
19. US Patent 9,030,858 Semiconductor device and structure, Issued on May 12th, 2015.
20. US Patent 9,029,173 Method for fabrication of a semiconductor device and structure, Issued May 12th, 2015.
21. US Patent 9,023,688 Method of processing a semiconductor device, May 5th, 2015. 
22. US Patent 9,000,557 Semiconductor device and structure, Issued April 7th, 2015.
23. US Patent 8,994,404 Semiconductor device and structure, Issued March 31st, 2015.
24. US Patent 8,993,385 Method to construct a 3D semiconductor device, Issued March 31st, 2015.
25. US Patent 8,987,079 Method for developing a custom device, Issued March 24th, 2015. 
26. US Patent 8,975,670 Semiconductor device and structure for heat removal, Issued March 10th, 2015.
27. US Patent 8,956,959 Method of manufacturing a semiconductor device with two monocrystalline layers, Issued February 17th, 2015.
28. US Patent 8,921,970 Semiconductor device and structure, Issued December 30th, 2014.
29. US Patent 8,912,052 Semiconductor device and structure, Issued December 16th, 2014.
30. US Patent 8,907,442 System comprising a semiconductor device and structure, Issued December 9th, 2014
31. US Patent 8,901,613 Semiconductor device and structure for heat removal, Issued December 2nd, 2014.
32. US Patent 8,902,663 Method of maintaining a memory state, Issued December 2nd, 2014.
33. US Patent 8,846,463 Method to construct a 3D semiconductor device, Issued September 30th, 2014.
34. US Patent 8,836,073 Semiconductor device and structure, Issued September 16th, 2014.
35. US Patent 8,823,122 Semiconductor and optoelectronic devices, September 2nd, 2014. 
36. US Patent 8,803,206 3D semiconductor device and structure, August 12th, 2014.
37. US Patent 8,754,533 Monolithic three-dimensional semiconductor device and structure, June 17th, 2014.
38. US Patent 8,753,913 Method for fabricating novel semiconductor and optoelectronic devices, June 17th, 2014.
39. US Patent 8,742,476 Semiconductor device and structure, June 3rd, 2014.
40. US Patent 8,709,880 Method for fabrication of a semiconductor device and structure, April 29th, 2014. 
41. US Patent 8,703,597  Method for fabrication of a semiconductor device and structure, April 22nd, 2014. 
42. US Patent 8,686,428 Semiconductor device and structure, April 1st, 2014.
43. US Patent 8,687,399 Semiconductor device and structure, April 1st, 2014. 
44. US Patent 8,674,470 Semiconductor device and structure, March 18th, 2014. 
45. US Patent 8,669,778 Method for design and manufacturing of a 3D semiconductor device, March 11th, 2014.
46. US Patent 8,664,042 Method for fabrication of configurable systems, March 4th, 2014.
47. US Patent 8,642,416 Method of forming three dimensional integrated circuit devices using layer transfer technique, February 4, 2014.
48. US Patent 8,581,349 3D memory semiconductor device and structure, November 12th, 2013. 
49. US Patent 8,574,929 Method to form a 3D semiconductor device and structure, November 5, 2013. 
50. US Patent 8,557,632 Method for fabrication of a semiconductor device and structure, October 15th, 2013.
51. US Patent 8,541,819 Semiconductor device and structure, Issued September 24th, 2013 
52. US Patent 8,536,023 Method of manufacturing a semiconductor device and structure, Issued September 17, 2013
53. US Patent 8,492,886 3D integrated circuit with logic, Issued July 23rd, 2013.
54. US Patent 8,476,145 Method of fabricating a semiconductor device and structure, Issued July 2, 2013
55. US Patent 8,461,035 Method for fabrication of a semiconductor device and structure, Issued June 11, 2013
56. US Patent 8,450,804 Semiconductor device and structure for heat removal, Issued May 28th, 2013
57. US Patent 8,440,542 Semiconductor device and structure, Issued May 14th, 2013
58. US Patent 8,427,200 3D semiconductor device, Issued April 23rd, 2013
59. US Patent 8,405,420 System comprising a semiconductor device and structure, Issued March 26, 2013
60. US Patent 8,395,191 Semiconductor device and structure, Issued March 12, 2013
61. US Patent 8,384,426 Semiconductor device and structure, Issued February 26, 2013
62. US Patent 8,379,458 Semiconductor device and structure , Issued February 19, 2013
63. US Patent 8,378,715 Method to construct systems, Issued February 19, 2013
64. US Patent 8,378,494 Method for fabrication of a semiconductor device and structure, Issued February 19, 2013
65. US Patent 8,373,439 3D semiconductor device, Issued February 12, 2013
66. US Patent 8,373,230 Method for fabrication of a semiconductor device and structure, Issued February 12, 2013
67. US Patent 8,362,482 Semiconductor Device and structure, Issued January 29, 2013
68. US Patent 8,362,800 3D semiconductor device including field repairable logics, Issued January 29, 2013
69. US Patent 8,298,875 Method for fabrication of a semiconductor device and structure, Issued October 30, 2012
70. US Patent 8,294,159 Method for fabrication of a semiconductor device and structure, Issued October 23, 2012
71. US Patent 8,283,215 Semiconductor and optoelectronic devices, Issued October 9, 2012
72. US Patent 8,273,610 Method of constructing a semiconductor device and structure, Issued September 25, 2012
73. US Patent 8,258,810 3D semiconductor device, Issued September 4, 2012
74. US Patent 8,237,228 System comprising a semiconductor device and structure, Issued August 7, 2012
75. US Patent 8,203,148 Semiconductor device and structure, Issued June 19, 2012
76. US Patent 8,163,581 Semiconductor and optoelectronic devices, Issued April 24, 2012
77. US Patent 8,153,499 Method for fabrication of a semiconductor device and structure, Issued April 10, 2012
78. US Patent 8,148,728 Method for fabrication of a semiconductor device and structure, Issued April 3, 2012
79. US Patent 8,115,511 Method for fabrication of a semiconductor device and structure, Issued February 14, 2012
80. US Patent 8,114,757 Semiconductor device and structure, Issued February 14, 2012
81. US Patent 8,058,137 Method for fabrication of a semiconductor device and structure, Issued November 15, 2011 
82. US Patent 8,026,521 Semiconductor device and structure, Issued September 27, 2011 
83. US Patent 7,986,042 Method for fabrication of a semiconductor device and structure, Issued July 26, 2011 
84. US Patent 7,960,242 Method for fabrication of a semiconductor device and structure, Issued June 14, 2011
85. US Patent 7,964,916 Method for fabrication of a semiconductor device and structure, Issued June 21, 2011