From what I hear at meetings, Qualcomm is one of the companies really driving towards production of 3D chips/packages. Of course, it makes perfect sense given their commitment to the mobile market, with its attendant constraints on power and footprint combined demands for significantly better system performance.
The interview is interesting on a number of fronts, especially his clear distinction between today's TSV based 3D and the future (that we're working towards) of true monolithic 3D:
"It is important to realize that there is 3D and then there is 3D. Some future 3D implementations – like stacking logic on logic – does require disruptive change in design tools. We will need design methodologies and tools that comprehend entirely a new dimension of parameters for this class of designs, and until these are developed, standards may even be a bit of a barrier.
On the other hand, 3D in the short term means heterogeneous stacking, like memory on top of logic. So right now, 3D is not that disruptive."
- Post by Dean Stevens, Monolithic 3D Evangelist
RSS Feed
