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EDA Cafe Interviews Riko Radojcic on 3D Standards

4/22/2011

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From what I hear at meetings, Qualcomm is one of the companies really driving towards production of 3D chips/packages.  Of course, it makes perfect sense given their commitment to the mobile market, with its attendant constraints on power and footprint combined demands for significantly better system performance.

The interview is interesting on a number of fronts, especially his clear distinction between today's TSV based 3D and the future (that we're working towards) of true monolithic 3D:

"It is important to realize that there is 3D and then there is 3D.  Some future 3D implementations – like stacking logic on logic – does require disruptive change in design tools.  We will need design methodologies and tools that comprehend entirely a new dimension of parameters for this class of designs, and until these are developed, standards may even be a bit of a barrier.

On the other hand, 3D in the short term means heterogeneous stacking, like memory on top of logic.  So right now, 3D is not that disruptive."
 
- Post by Dean Stevens, Monolithic 3D Evangelist
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