I am pleased to introduce you to IntSim v2.0 today. IntSim v2.0 is a CAD tool to simulate and optimize monolithic versions of 2D and 3D-ICs.
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I am pleased to introduce you to IntSim v2.0 today. IntSim v2.0 is a CAD tool to simulate and optimize monolithic versions of 2D and 3D-ICs.
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 We have a guest contribution today from Brian Cronquist, where he talks about innovation he has been involved with in his career. He also talks about the first year of NuPGA/MonolithIC 3D Inc.'s existence, when the company was focused on FPGAs, and discusses how the transition to Monolithic 3D began.  We have a guest contribution today from Paul Lim, MonolithIC 3D Inc.'s Principal Device Engineer. Paul is one of the best device simulation people I know, and has spent many years working on that subject. He talks about how device simulations can aid 3D-IC research. I recently visited the Technical University of Munich (TUM) and gave a presentation. It was a fun experience, let me describe it...
Like I said in my last blog-post, I’m at IITC this week. The keynote speech of the conference was given by Dirk Wristers, VP of Technology & Integration at Globalfoundries. It was quite interesting, let me share some details...
 We have a new blog-post today from Brian Cronquist, VP of Technology at MonolithIC 3D Inc. In this post, he talks about innovation and how it can be managed. Brian has excellent management skills and is very well-organized - I have always enjoyed hearing his thoughts on people and project management.
I'll be traveling to Dresden, Germany next week for the Interconnect Interconnect Technology Conference (IITC). Thought I should give a preview of the conference...
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