Semiconductor Manufacturing & Design has a very interesting discussion of the ways that die stacking will impact final product yields.
For me, the money quote was,
"There’s a requirement for more interaction. We have to partner with our customers to be successful. While we see that test, manufacturing and design need to be linked,..."
Clearly, 3D IC blurs a lot of boundaries and it will require establishing an ecosystem that spans the supply chain. There's a lot of work to be done, and a lot of opportunities for innovative companies to prosper by helping to build out this system.
- Post by Dean Stevens, Monolithic 3D Evangelist
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