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 We have a guest contribution today from Zvi Or-Bach, the President and CEO of Monolithic 3D Inc. Zvi argues that the EDA vendors need to form relationships with their customers that allows the tool companies to share the risks and rewards that come with striving for improved yields.
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Believe it or not, the answer is "TRUE"!  Who did it? It was Matrix Semiconductor, a Silicon Valley startup, who shipped the world's first monolithic 3D products in 2003. These were One-Time Programmable (OTP) non-volatile memory chips that had multiple layers of polysilicon diodes in series with antifuses. See picture alongside. We tend to approach the world of 3D IC from the perspective of technology innovators, so it's always interesting for me to hear the perspectives of the design tools community as well as the semiconductor companies actually implementing solutions. That's why I particularly appreciated Richard Goering's report covering the IEEE Electronic Design Processes (EDP) workshop.
Paul McLellan made an interesting series of posts over on his edagraffiti blog a while back. If you're interested in the EDA perspective on 3D ICs, you should go check them out. You probably should go read them just because Dr. McLellan is a great writer who always adds value with his observations. His list of relevant posts includes:
EETimes had a nice report on the recent International Symposium on Physical Design (ISPD), held March 27-30, 2011 in Santa Barbara, CA. For our purposes, the particularly interesting bits were:
 We have a blog-post today from Paul Lim, Monolithic 3D Inc.'s Principal Device Engineer. Paul is an ex-Stanford grad and is a visiting researcher at Stanford University's Center for Integrated Systems... he will talk about 3D-IC work going on at Stanford. There are a couple of interesting meetings coming up in the next several weeks that highlight one of the questions that has been lurking around the 3D movement for as long as I can remember. One group, that is well represented by the discussion at these meetings, sees 3D as a packaging issue. Perhaps that's why the IEEE CPMT-SV is such an active sponsor of these discussions:
As many of you know, repeaters are gates that are inserted in the middle of long wires to speed them up. Let's discuss these interesting devices...
 We have a guest contribution today from Zvi Or-Bach, the President and CEO of Monolithic 3D Inc. Zvi explains why he believes the time for Monolithic 3D is NOW. Zvi Or-Bach, our Founder and CEO was interviewed by Debra Vogler, Senior Technical Editor at ElectroIQ for an article titled "3D IC is only solution for scaling "up," says MonolithIC 3D exec"
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