New to the group are:
- Advanced Semiconductor Engineering Inc. (ASE)
- Altera Corp.
- Analog Devices Inc. (ADI),
- LSI Corp.
- On Semiconductor Corp.
- Qualcomm Inc.
It's interesting to see Qualcomm signing up to this effort. They've been a prominent driver for a lot of the existing work to bring TSV based 3-D into production. I'm sure that the big "Q" will benefit from standardization in this area.
Existing members include:
- Globalfoundries
- Hewlett Packard
- Hynix
- IBM
- Intel
- Samsung
- UMC
- Post by Dean Stevens, Monolithic 3D Evangelist