Dr. Garrou has an excellent post that includes a segment on work at Penn State and IBM on the ways that dense TSVs can impact thermal management.
"... large copper TSVs improve the vertical heat dissipation whereas dense and insulated tungsten via farms act as lateral thermal blockage. With the proposed TSV bus optimization flow the peak temperature can be reduced as much as 18.5K and the average temperature reduced by 4.3K."
Fascinating stuff. At a previous company, our theoretical design relied on TSVs for cooling, so it's nice to see research that suggests that our designs might have actually worked.
- Post by Dean Stevens, Monolithic 3D Evangelist
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