In the News

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success
04/18/2013 | San Francisco Chronicle
Our latest press release shared by San Francisco Chronicle.

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success
04/18/2013 | Electronics WeSrch
Our latest press release shared by Electronics WeSrch website.

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success
04/18/2013 | redOrbit
Our latest press shared by redOrbit webpage.

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success
04/18/2013 | Timesunion
Our latest press release shared by Timesunion.

MonolithIC 3D Inc. Announces its Advisory Board Members
04/03/2013 | San Francisco Chronicle
Our latest press release shared by San Francisco Chronicle.

MonolithIC 3D Inc. Announces its Advisory Board Members
04/03/2013 | Timesunion
Our latest press release shared by Timesunion.

MonolithIC 3D Inc. Announces its Advisory Board Members
04/03/2013 | Digital Journal
Our latest press release shared by Digital Journal.

Blog: Dimensional scaling and the SRAM bit-cell
03/21/2013 | Solid State Technology
Solid State Technology Magazine sharing our latest blog post.

MonolithIC 3D, Inc.'s Ground-Breaking Technology Receives 30th Patent
03/15/2013 | info Tech
info Tech website sharing our latest press release. 

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology
03/18/2013 | Red Orbit
Red Orbit website sharing our company's latest press release.

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology
03/18/2013 | EE Times India 
EE Times sharing our company's latest press release.

IEDM 2012: The pivotal point for monolithic 3D ICs
01/29/2013 | Solid State Technology
Solid State Technology Magazine sharing our latest blog post.

MonolithIC 3D Inc. Shows 3D-ICs Can Be Effectively Cooled
01/20/2013 | Embedded Computing Design
Embedded Computing Design Magazine sharing our latest press release.

Moore's Law Scaling Stymied at 14nm?
01/15/2013 | HPC wire
HPC wire website's article on our blog piece. 

Moore’s Law seen hitting big bump at 14 nm
01/11/2013 | EE Times 
EE Times sharing our company's blog post, the point of view of Zvi O-Bach, Founder and CEO of MonolithIC 3D Inc.

Tying up 2012 3D IC Loose Ends
01/04/2012 | 3D InCites
Francoise Von Trapp writing about our blog post.

IEDM goes deep on 3-D circuits
12/10/2012 | EE Times
EE Times article about our participation  at IEDM. 

MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology
12/10/2012 | San Francisco Chronicle
Our press release was covered by San Francisco Chronicle.

MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology
12/05/2012 | RedOrbit 
RedOrbit website sharing our press release.

3D Company Updates
12/05/2012 | 3D InCites
Francoise Von Trapp writing about our press release

ABC 9 KTRE News Website: MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology
12/04/2012 | ABC 9 KTRE
Our press release was covered by ABC 9 KTRE News Website.

Fox 19 News Website: MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology
12/04/2012 | Fox 19
Our press release was covered by Fox 19 News Website.

Virtual Strategy Magazine: MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology
12/04/2012 | Virtual Strategy Magazine
Our press release was covered by Virtual Strategy Magazine.

US Patent granted to MonolithIC 3D Inc. on October 09 titled as "Semiconductor and optoelectronic devices"
10/11/2012 | Laser Focus World
Laser Focus World's article about MonolithIC 3D Inc.

Qualcomm overtakes Intel in market capitalization
11/20/2012 | EE Times 
EE Times sharing our company's latest blog post, the point of view of Zvi O-Bach, Founder and CEO of MonolithIC 3D Inc.

Focus on monolithic 3D-ICs paradigm shift for semicon industry
11/19/2012 | Pradeep Chakraborty's Blog
Pradeep Chakraborty's Blog Post about MonolithIC 3D Inc.

MonolithIC 3D Assigned Patent
29/10/2012 | TMCnet.com
TMCnet.com writing about Monolithic 3D IC's Patents.

Monolithic 3D IC Technologies
07/20/2012 | All Programmable Planet
All Programmable Planet's article about Monolithic 3D ICs technology.

Is the cost reduction associated with IC scaling over?
07/16/2012 | EE Times
EE Times sharing our blog post about cost reduction associated with scaling.

SEMICON West 2012 exhibits preview: Lithography focus
06/27/2012 | Solid State Technology
Solid State Technology Insights for Electronics Manufacturing describing our technology. 

Is the Cost Reduction Associated with Scaling Over?
06/21/2012 | Design & Reuse
Industry Expert Blogs sharing our latest blog post.

Embedded Computing Design Selects Top Innovators in Embedded Design
06/15/2012 | Embedded Computing Design
Embedded Computing Design's article about Zvi Or-Bach's award.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator ' Silicon by Embedded Computing Design Magazine
06/13/2012 | State Journal
Our press release was covered by State Journal on June 13, 2012.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., Selected as Top Embedded Innovator - Silicon by Embedded Computing Design Magazine
06/13/2012 | San Francisco Chronicle
Our press release was covered by San Francisco Chronicle on June 13, 2012.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator - Silicon by Embedded Computing Design Magazine
06/13/2012 | Fox 8 Live
Our press release was covered by Fox 8 Live website on June 13, 2012.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine
06/13/2012 | Virtual-Strategy Magazine
Virtual-Strategy Magazine sharing our press release.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., Selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine
06/13/2012 | Timesunion
Our press release was covered by Timesunion.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine
06/13/2012 | Digital Journal
Digital Journal sharing our press release.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine
06/13/2012 | 9 and 10 News 
Our press release was covered by 9 and 10 News website.

2012 Top Embedded Innovator – Silicon: Zvi Or-Bach, Founder and CEO, MonolithIC 3D
06/04/2012 | Designer 3d Glasses
Designer 3D Glasses sharing the news about Zvi Or-Bach, Founder and CEO of MonolithIC 3D Inc.'s Award.

2012 Top Embedded Innovator - Silicon: Zvi Or-Bach, Founder and CEO, MonolithIC 3D (Front Cover)
06/04/2012 | Embedded Computing Design
Embedded Computing Design's article about Zvi Or-Bach, the Founder and CEO of MonolithIC 3D Inc.

Intel vs. the Foundries: where is advanced logic heading?
06/04/2012 | Design & Reuse
Industry Expert Blogs sharing our latest blog post.

MonolithIC 3D Inc., a Finalist at Semicon West 2011, Announces its Return to the 2012 Event
05/31/2012 | Virtual-Strategy Magazine
Our press release was covered by Virtual-Strategy Magazine on May 31st, 2012.

MonolithIC 3D Inc., a Finalist at Semicon West 2011, Announces its Return to the 2012 Event
05/31/2012 | Digital Journal
Our press release shared by Digital Journal on May 31st.

The Future is the Interconnect: IITC
05/21/2012 | Design & Reuse
Industry Expert Blogs sharing our blog post about IITC on May 21st, 2012.

MonolithIC 3D Inc. Participated at IP Counsel Café, 2012
05/17/2012 | San Francisco Chronicle
Our press release was covered by San Francisco Chronicle.

Reversal from the foundry model back to IDM?
05/16/2012 | Future Fab Magazine
Our blog post was covered by Future Fab Magazine.

Reversal from the foundry model back to IDM ?
05/11/2012 | EE Times
Our blog post was covered by EE Times.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
04/25/2012 | Digital Journal
Our press release was covered by Digital Journal.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
04/25/2012 | IT Business Net
Our press release was covered by IT Business Net.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
04/25/2012 | The San Francisco Chronicle
Our press release was covered by The San Francisco Chronicle.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
04/25/2012 | Road Runner Holding
Our press release was covered by Road Runner Holding's website.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
04/25/2012 | Designer 3D Glasses
Our press release was covered by Designer 3D Glasses.

TSV when mass production?
04/13/2012 | EE Times Taiwan
Our blog post was covered by EE TImes Taiwan on April 13th, 2012.

Viewpoint: Is TSV for real?
04/09/2012 | EE Times
Our blog post was covered by EE Times on April 9th, 2012

Is NVIDIA in a Panic? If so, what about AMD? Other fabless companies?
04/02/2012 | Design and Reuse
Industry Expert Blogs sharing our blog post about NVIDIA

Could 3d chip technology extend Moore's law to 2030?
03/30/2012 | Next Big Future
Interview for the Next Big Future's website with Zvi Or-Bach, CEO of MonolithIC 3D Inc.

MonolithIC 3D Inc.'s 2D and 3D-ICs Simulator Tool is a Worldwide Hit
03/28/2012 | San Francisco Chronicle
Our press release was covered in San Francisco Chronicle.

MonolithIC 3D Inc.'s 2D and 3D-ICs Simulator Tool is a Worldwide Hit
03/28/2012 | Virtual-Strategy Magazine
Our press release was covered in Virtual-Strategy Magazine.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Finalist for EETimes’ Innovator of the Year Award
02/28/2012 | Yahoo! News
Our press release was covered in an article in Yahoo! News.

MonolithIC 3D Inc. Granted Fundamental Patents on 3D-ICs for Logic and Memory Applications
02/06/2012 | UAA Today
News article about our press release in UAA Today's.

Monolithic 3D: A Basic Primer
01/30/2012 | 3D InCites
Press coverage about our technology in 3DIncites's webpage.

Is 3D IC Packaging Ready For Prime Time?
12/28/2011 | Electronic Design
Press coverage about our technology in Electronic Design Magazine.

Overview of Monolithic 3D Integration solutions for 3D flash memories
12/13/2011 | I-Micronews
Press coverage about our monolithic 3d flash memories in I-Micronews.

MonolithIC 3D Issued 5th Patent on 3D IC Technology
12/10/2011 | Euroasia Semiconductor
Our press release was covered in Euroasia Semiconductor Magazine.

Do Foundries Have Too Much Power?
12/12/2011 | Design & Reuse
Our blog post was covered by the Design and Reuse

3D Thursday: Is 2.5D IC assembly “buzz-worthy”?
12/08/2011 | EDA360 Insider
Our blog post was covered by the EDA360 Insider blog. 

Is the Buzz around Xilinx's 2.5D FPGA Justified?
12/05/2011 | Design&Reuse
Press coverage about Deepak Sekar's latest blog post.

What can 20MW Exascale computers teach us about SoC Realization?
11/29/2011 | EDA360 Insider
Steve Leibson's article on Deepak Sekar's blog post about  "The Dally-nVIDIA-Stanford Prescription for Exascale Computing".

3D chips: The next electronics revolution
11/02/2011 | Computerworld
Press coverage about our VP of Technology, Brian Cronquist in Computerworld

Perspectives on Low Temperature Wafer Direct Bonding for Monolithic 3D Integration
10/27/2011 | Semiconductor Packaging News
Our blog post was covered by Semiconductor Packaging News.

Perfecting the 3-D chip
10/11/2011 | EE Times
Press coverage about Zvi Or-Bach, CEO of MonolithIC 3D Inc.

The real cost in the move to 450mm wafers
10/05/2011 | Electronics News 
Electronics News's article on Deepak Sekar's blog post about 450nm wafers.

How to Create American Jobs
10/03/2011 | The Huffington Post
The Huffington Post's article about Zvi Or Bach, CEO at MonolithIC 3D Inc.

Interconnect Power II
10/03/2011 | Chip Design Magazine
Chip Design Magazine's article based on Deepak Sekar's blog post on analyzing Intel’s 22 nm FinFET technology versus a hypothetical planar 22nm CMOS technology.

Can 450nm Decommoditize the Semiconductor Industry?
10/03/2011 | Design & Reuse
Industry Expert Blogs sharing Deepak Sekar's blog post about 450nm wafers.

Overcoming direct source-drain tunnelling limitations for CMOS transistors
09/27/2011 | Electronics News Australia
Electronics News Australia's cover story of the magazine about Deepak Sekar's blog post.

Viewpoint: What lies ahead for on-chip interconnect technology?
09/19/2011 | EETimes
EETimes published our blog post.

Future Horizons forum focuses on 'new rules'
09/15/2011 | EETimes
EE Times article about The International Electronics Forum. Among the forum's speakers there is  Zvi Or-Bach, CEO MonolithIC 3D.

3D ICs without TSVs?
08/31/2011 | EDN
Electronic Design News (EDN)'s article about the ion cutting process

Zvi Or Bach President & CEO of MonolithIC 3D is now a member of Partnership for a New American Economy
08/30/2011 | Partnership for a New American Economy
Partnership for a New American Economy

MonolithIC 3D Inc. Advocates Talent-based Recovery of the US Economy
08/18/2011 | San Francisco Chronicle
San Francisco Chronicle’s article about our press release

MonolithIC 3D Inc. Voices Concern that K-12 Science Framework Produces Technology Consumers, Not Technology Creators
08/10/2011 | San Francisco Chronicle
San Francisco Chronicle's article on our press release

Viewpoint: Will tri-gate play key role in Intel-ARM tussle?
08/09/2011 | EETimes
EE Times article about our viewpoint for fabricating three-dimensional ICs which differs from Intel's tri-gate technology.

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