Interesting bit in EETimes about a new effort to develop standards for 3D IC development.
Here's the main blurb:
"The so-called Open3D Project will enable interoperable 2.5-D/3-D design and EDA flows with open standards, according to Si2. "
I wonder if they're talking to the companies involved in SEMATECH's 3D Enablement program.
However, at least from my perspective, the real message to those of us trying to push the technology is:
"Many wonder if mainstream 3-D chips based on TSV technology is feasible-or will even fly-amid ongoing problems in the arena. The progress remains slow and the technology still appears to be in the 'power point' stage."
...and it's our job to show that the reality is closer than they think!
- Post by Dean Stevens, Monolithic 3D Evangelist
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