Monolithic 3D DRAM
Monolithic 3D IC technology can be applied to producing a monolithically stacked single crystal silicon double-gated floating body DRAM memory. Lithography steps are shared among multiple memory layers to reduce bit cost. Peripheral circuits below the monolithic memory stack provide control functions.
Reduce DRAM bit cost without investing in expensive scaling down.
Our 3D DRAM technology innovatively combines these well-studied technologies:
- Monolithic 3D with litho steps shared among multiple memory layers
- Stacked Single crystal Si with ion-cut
- Double gate floating body RAM cell with charge stored in body