Zvi Or-Bach
Founder and CEO of MonolithIC 3D™Inc.
Zvi Or-Bach is the founder and CEO of MonolithIC 3D™Inc.
Or-Bach is a world-recognized expert in monolithic 3D technologies, past chairman of the 3D of IEEE S3S Conference, and is active as an invited speaker and tutorial instructor in the US, Korea, and Japan, and the author of four Monolithic 3D related chapters in NANO-CHIPS 2030 and the chapter in Chips 2020 Vol II.
At the IEEE S3S 2017 Or-Bach published a landmark paper titled: “A 1,000x Improvement in Computer Systems by Bridging the Processor Memory Gap” that leverages innovative monolithic 3D integration while using existing transistor and fab processes.
Or-Bach is currently Chairman of the Board for Zeno Semiconductors. Or-Bach has a history of innovative development in fast-turn ASICs for over 20 years. His vision led to the invention of the first Structured ASIC architecture, the first single via programmable array, and the first laser-based system for one-day Gate Array customization.
Prior to founding and running MonolithIC 3D since 2009, Or-Bach founded eASIC in 1999 and served as its CEO for six years. eASIC was funded by leading investors such as Vinod Khosla and KPCB, in three successive rounds. Intel acuired eASIC in 2018. Under Or-Bach's leadership, eASIC won the prestigious EETimes' 2005 ACE Award for Ultimate Product of the year in the Logic and Programmable Logic category and the Innovator of the Year Award and was selected by EE Times to be part of the “Disruptors—The people, products and technologies that are changing the way we live, work and play.”eASIC was acquired by Intel.
Earlier, Or-Bach founded Chip Express in 1989 and served as the company's president and CEO for 10 years, bringing the company to revenue of $40M. Chip Express was acquired by GigOptix which was later acquired by IDT.
Zvi Or-Bach received his BSc degree (1975) cum laude in electrical engineering from the Technion – Israel Institute of Technology, and MSc (1979) with distinction in computer science, from the Weizmann Institute, Israel. He holds over 460 issued patents, primarily in the field of 3D integrated circuits and semi-custom chip architectures.
Or-Bach is a world-recognized expert in monolithic 3D technologies, past chairman of the 3D of IEEE S3S Conference, and is active as an invited speaker and tutorial instructor in the US, Korea, and Japan, and the author of four Monolithic 3D related chapters in NANO-CHIPS 2030 and the chapter in Chips 2020 Vol II.
At the IEEE S3S 2017 Or-Bach published a landmark paper titled: “A 1,000x Improvement in Computer Systems by Bridging the Processor Memory Gap” that leverages innovative monolithic 3D integration while using existing transistor and fab processes.
Or-Bach is currently Chairman of the Board for Zeno Semiconductors. Or-Bach has a history of innovative development in fast-turn ASICs for over 20 years. His vision led to the invention of the first Structured ASIC architecture, the first single via programmable array, and the first laser-based system for one-day Gate Array customization.
Prior to founding and running MonolithIC 3D since 2009, Or-Bach founded eASIC in 1999 and served as its CEO for six years. eASIC was funded by leading investors such as Vinod Khosla and KPCB, in three successive rounds. Intel acuired eASIC in 2018. Under Or-Bach's leadership, eASIC won the prestigious EETimes' 2005 ACE Award for Ultimate Product of the year in the Logic and Programmable Logic category and the Innovator of the Year Award and was selected by EE Times to be part of the “Disruptors—The people, products and technologies that are changing the way we live, work and play.”eASIC was acquired by Intel.
Earlier, Or-Bach founded Chip Express in 1989 and served as the company's president and CEO for 10 years, bringing the company to revenue of $40M. Chip Express was acquired by GigOptix which was later acquired by IDT.
Zvi Or-Bach received his BSc degree (1975) cum laude in electrical engineering from the Technion – Israel Institute of Technology, and MSc (1979) with distinction in computer science, from the Weizmann Institute, Israel. He holds over 460 issued patents, primarily in the field of 3D integrated circuits and semi-custom chip architectures.