"CEA-Leti is moving toward pilot production of 3D semiconductor structures on 300mm wafers at its research centre in Grenoble, France.
CEA-Leti has installed fabrication tools supplied by EV Group in its first 300mm cleanroom dedicated to R&D and prototyping for 3D-integration applications."
According to the story,
"The ultimate goal is the transfer of the processes to industrial partners' high-volume manufacturing environments."
While their focus appears to be on TSV, rather than true monolithic 3D, it's nice to see another announcement that shows how widespread work on 3D semiconductors has become.
"...the institute's 3D offerings include TSVs along with advanced capabilities in alignment, bonding, thinning and interconnects."
All capabilities that are required for establishing the infrastructure of a healthy 3D "ecosystem."
- Post by Dean Stevens, Monolithic 3D Evangelist