Monolithic 3D Inc., the Next Generation 3D-IC Company
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Monolithic 3D Image Sensors

3d ic

Technology

The monolithic 3D IC technology is extended by adding multiple image sensor layers. Monolithically integrate CMOS signal processing arrays with multiple layers of image sensors with very rich vertical interconnects.

Key Features:
  • Vertical interconnect pitch <100nm
  • Typical stratum thickness     <1um     

Benefits

  • Visible and infrared sensors integrated in a single stack – Day/Night capability in one stack.
  • Multi-spectrum Imager
  • Extremely high dynamic range
  • Extremely high speed capture
  • High resolution
  • Dramatic reduction in power, size and cost


Imager Options


3d ic
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