Monolithic 3D Image Sensors

Technology

The monolithic 3D IC technology is extended by adding multiple image sensor layers. Monolithically integrate CMOS signal processing arrays with multiple layers of image sensors with very rich vertical interconnects.

Key Features:

• Vertical interconnect pitch <100nm
• Typical stratum thickness     <1um     
  

Benefits

• Visible and infrared sensors integrated in a single stack – Day/Night capability in one stack.
• Multi-spectrum Imager
• Extremely high dynamic range
• Extremely high speed capture
• High resolution
• Dramatic reduction in power, size and cost
  

Imager Options