The next generation technology driver - monolithic 3D

Monolithic 3D moving forward for SoC and logic devices. The latest news in the semiconductor industry reveals an important strategic relationship between Qualcomm Technologies and Semiconductor Manufacturing International Corporation SMIC. The latest is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. "SMIC is further strengthening its strategic relationship with Qualcomm Technologies. SMIC will work with Qualcomm Technologies in bringing new 28nm design-ins and products for the growing mobile communication industry. Going forward, SMIC will also extend its technology offerings on 3D IC and RF front-end wafer manufacturing in support of Qualcomm Technologies". As Zvi Or-Bach, Presindet and CEO of MonolithIC 3D Inc. recently reported in our blog: "Qualcomm Calls for Monolithic 3D IC", first developing EDA with help of Georgia Tech., than support the process development at CEA Leti, and now setting up volume production with SMIC. This is the first announcement of moving to monolithic 3D for SoC and logic devices after Samsung already reported mass production of for monolithic 3D in first 3D vertical NAND flash.

Source:

- SMIC and Qualcomm Collaborate on 28nm Wafer Production in China – Solid State Magazine [http://electroiq.com/blog/2014/07/smic-and-qualcomm-collaborate-on-28nm-wafer-production-in-china/];

- China's SMIC-Qualcomm 28-nm Deal: Why Now? - EE Times [http://www.eetimes.com/document.asp?doc_id=1322988&piddl_msgid=306046#msg_306046];