A few weeks back, in my "Looking Beyond Lithography" post, I explained the reasons why flash memory makers such as Toshiba, Samsung and Hynix are exploring an alternative approach to Moore's law. In this blog-post, let's see if this approach is viable for logic technologies...
 We have a guest contribution today from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc. In this post, Zvi discusses the implications of monolithic 3D for embedded memories. I am pleased to introduce you to IntSim v2.0 today. IntSim v2.0 is a CAD tool to simulate and optimize monolithic versions of 2D and 3D-ICs.  We have a blog post today from Ze'ev Wurman, the Chief Software Architect of MonolithIC 3D Inc. Ze'ev spent many years leading EDA/software work at Dynachip, eASIC and Amdahl. In today's post, he explores vertical integration in the world of FPGAs. For the past 40 years, semiconductor technologists relied on improvements in lithography to "cram more components onto integrated circuits". Toshiba, Samsung and other non-volatile memory companies are betting the future will be different. Let's look at the fascinating idea they're pursuing...
 We have a guest contribution today from Zvi Or-Bach, the President and CEO of Monolithic 3D Inc. Zvi argues that the EDA vendors need to form relationships with their customers that allows the tool companies to share the risks and rewards that come with striving for improved yields. We tend to approach the world of 3D IC from the perspective of technology innovators, so it's always interesting for me to hear the perspectives of the design tools community as well as the semiconductor companies actually implementing solutions. That's why I particularly appreciated Richard Goering's report covering the IEEE Electronic Design Processes (EDP) workshop.
As many of you know, repeaters are gates that are inserted in the middle of long wires to speed them up. Let's discuss these interesting devices...
 We have a blog post today from Ze'ev Wurman, the Chief Software Architect of MonolithIC 3D Inc. Ze'ev spent many years leading EDA/software work at Dynachip, eASIC and Amdahl. He will discuss CAD tools for 3D-ICs. |
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