We tend to approach the world of 3D IC from the perspective of technology innovators, so it's always interesting for me to hear the perspectives of the design tools community as well as the semiconductor companies actually implementing solutions. That's why I particularly appreciated Richard Goering's report covering the IEEE Electronic Design Processes (EDP) workshop.
Some tidbits that caught my attention include:
A side note: As someone who has been reading electronics industry trade press for many years, I'm quite pleased to note that Mr. Goering has found what appears to be a good home at Cadence. Good for him!
- Post by Dean Stevens, Monolithic 3D Evangelist
- TI's representative stated that they are scaling up because, "We have a very clear business need, we're comfortable the technology is there, and now we have to make sure it's what customers want and are willing to pay for."
- Mentor's panelist hypothesized that, "2.5D assembly will be by OSAT (outsourced assembly and test), while 3D will stay with foundries." (I agree)
- Another, comment from TI's panelist was particularly encouraging to me, "There's another factor that will help drive 3D IC adoption - enthusiasm. There's a lot of excitement among top notch engineers at TI. You'd be surprised how much you can push your people to engage in this."
A side note: As someone who has been reading electronics industry trade press for many years, I'm quite pleased to note that Mr. Goering has found what appears to be a good home at Cadence. Good for him!
- Post by Dean Stevens, Monolithic 3D Evangelist
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