- TI's representative stated that they are scaling up because, "We have a very clear business need, we're comfortable the technology is there, and now we have to make sure it's what customers want and are willing to pay for."
- Mentor's panelist hypothesized that, "2.5D assembly will be by OSAT (outsourced assembly and test), while 3D will stay with foundries." (I agree)
- Another, comment from TI's panelist was particularly encouraging to me, "There's another factor that will help drive 3D IC adoption - enthusiasm. There's a lot of excitement among top notch engineers at TI. You'd be surprised how much you can push your people to engage in this."
A side note: As someone who has been reading electronics industry trade press for many years, I'm quite pleased to note that Mr. Goering has found what appears to be a good home at Cadence. Good for him!
- Post by Dean Stevens, Monolithic 3D Evangelist