We have a guest contribution today from Zvi Or-Bach, the President and CEO of Monolithic 3D Inc. Zvi explains why he believes the time for Monolithic 3D is NOW.
Let me tell you why I believe the time for monolithic 3D is now!
Before presenting the argument for “why now”, we may want to consider why the 3D-IC has not happened until now. My best explanation is that it was not really needed. As they say, "If it ain't broke, don't fix it". Scaling worked great over the past few decades - 2X increased density, coupled with higher speed and reduced power, were worth dying for. The system industry needed to work very hard to develop and bring to market products that utilized this rapid improvement of device cost performance and complexity. Semiconductor vendors had their hands full with all the challenges associated with scaling. In short, we were too busy staying on course to explore "futuristic" ideas.
So what has changed?
It is now broken!
Scaling now is associated with escalating costs of process development and capital investment as illustrated by the following charts.
And to make matters worse, when these escalating costs are calculated for their impact on the end device cost, we now face, for the first time in semiconductor history, an increase of device cost with scalingfor many applications and vendors. See the following chart (Courtesy IBS).
Scaling up using monolithic 3D would allow us to continue Moore's Law, something the high tech industry and its users are so addicted to. This would double the number of end device transistors at similar or reduced prices and with additional performance improvements.
If monolithic 3D can do it, then the time of monolithic 3D is NOW!