We have a guest contribution today from Zvi Or-Bach, MonolithIC 3D Inc.'s President and CEO. Zvi talks about some good news we received from the Semicon West committee recently.
I wish everybody the sense of joy we had reading these words of an email we received late yesterday: "Congratulations! The MonolithIC 3D technology has been recognized as a Finalist in the 2011 Best of West Award, recognizing important product and technology developments in the microelectronics supply chain" (please click on the link to read a news article about this).
Coming out from stealth mode in December 2010 and disclosing our breakthrough monolithic 3D IC technology was the beginning of a marketing campaign to make the industry aware that the monolithic 3D-IC is possible and practical. Years of experience in technology innovation have taught us that creating awareness about a technology is no less critical for its success than creating the technology itself. And even more so when the technological challenge is high.
Knowing that monolithic 3D was considered “unattainable” by many in academia and industry, we knew we had our work cut out for us.
From that point on we signed up to speak, present and teach at any opportunity we could get. We worked hard on our web site to provide detailed disclosures of our innovative path to the monolithic 3D-IC, we added an open source high level simulation tool to enable easy evaluation of 3D IC vs. 2D IC, and we committed ourselves to publish blog pieces twice a week.
Our first indication of progress was reported on our 06/16/2011 blog:" This week has been a busy week for our company. We were invited to speak at three different forums across the continent! Zvi Or-Bach, our President and CEO, went to Chicago to speak at a 3D workshop at the TIPP 2011. Deepak Sekar, our Chief Scientist, went to speak at a 3D workshop at San Jose and Brian Cronquist, our VP of Technology, went to Canada to speak at the CMOS Emerging Technologies workshop"
And now being one of just three finalists for a show with 630 exhibitors indicates additional and very important progress. It is worth noting that two of the three finalists are related to 3D-ICs. Add to it the recent EETimes headline, "TSMC may beat Intel to 3-D chips", it does look like the 3D-IC is moving closer to reality. On our part, we have been pushing technology development along with our marketing effort as we recently released detailed information on two additional derivatives of our 3D-IC technology - Monolithic 3D DRAM and Monolithic 3D Resistive memory. And as part of our Semicon West show, we have put together a total of 10 brief technology disclosures now available on our web:
- Monolithic 3D Logic Technology - with RCATs
- Monolithic 3D Logic Technology - with Replacement Gate Technology
- Monolithic 3D DRAM
- Monolithic 3D NAND Flash Memory
- Monolithic 3D Resistive Memory
- Monolithic 3D FPGA
- Monolithic 3D Gate Array
- Monolithic 3D Redundancy and Repair
- Monolithic 3D Image Sensor
- Monolithic 3D Microdisplay
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