Shekhar Borkar, a Fellow at Intel, and Andrew Chien, the VP of Intel Research, wrote a provocative and much-circulated article titled "The Future of Microprocessors" a few months back. Let's discuss this article today...
A few weeks back, I received a paper titled "The Future of Microprocessors" from a colleague. Hmmm, I thought, that's a bold title to use. A quick look showed me the article was written by two well-known names in our industry: Shekhar Borkar, a Fellow at Intel and Andrew Chien, the VP of Intel Research (Chien left Intel recently to become a Professor at the University of Chicago). The paper was published in May 2011 in the Communications of the ACM. Let me first summarize the paper's contents... I will then share with you my thoughts on its message.
The Problem Statement
Microprocessor performance has improved by a factor of 30x every decade for the past 40 years. This 30x number should be our goal for the next decade, say Borkar and Chien. The main complication is meeting these goals in today's scenario where transistor scaling provides decreased benefits. When supply voltage reduces by 5%, clock frequency increases by 15% and capacitance decreases by 25% every generation, one can get just a 2.5x performance benefit in a decade for dual-core chips, say the authors. This is well short of the 30x required. Can we innovate and get around this issue?
Multiple Cores, Heterogeneous Cores
By moving to multiple small cores or a combination of many small and big cores, the maximum throughput increase we can get is greater than 10x, according to Borkar and Chien. Please see the table below. This brings us closer to our 30x goal, but the numbers assume software is completely parallel :-(
Instead of using general purpose cores for all the 20-30 cores, the authors suggest we can use special purpose "accelerator" cores in combination with general purpose cores. A typical SoC used in smartphones today has 10-20 such accelerator cores for applications such as graphics, media, image, cryptography, radio and digital signal processing. The trend of integrating CPUs and GPUs in PCs is one step in this direction. Energy-efficiency benefits can be as high as 50x-500x for certain workloads, say the authors.
Extreme Circuits, Variability and Resilience
In a heterogeneous multi-core architecture, some cores could be operated at very low supply voltages close to the threshold voltage. This can provide an order of magnitude higher energy-efficiency. The loss of performance from low supply voltages can be compensated by operating multiple cores in parallel. However, significant issues with variability arise, since performance can fluctuate dramatically with threshold voltage variations. Various techniques to handle this issue could be used in future microprocessors, such as in-field diagnosis, reconfiguration and adaptability.
Handling Interconnect Issues
Borkar and Chien say that in a decade's time, as much as 90% of a chip's energy budget could be used to just communicate data to execution units from memory. To tackle this issue, they suggest that future microprocessors could have large register files close to execution units. While large register files are considered a no-no for performance reasons today, the authors say that in the future when raw frequency is not our key constraint, this could be ok.
Extreme Circuits, Variability and Resilience
In a heterogeneous multi-core architecture, some cores could be operated at very low supply voltages close to the threshold voltage. This can provide an order of magnitude higher energy-efficiency. The loss of performance from low supply voltages can be compensated by operating multiple cores in parallel. However, significant issues with variability arise, since performance can fluctuate dramatically with threshold voltage variations. Various techniques to handle this issue could be used in future microprocessors, such as in-field diagnosis, reconfiguration and adaptability.
Handling Interconnect Issues
Borkar and Chien say that in a decade's time, as much as 90% of a chip's energy budget could be used to just communicate data to execution units from memory. To tackle this issue, they suggest that future microprocessors could have large register files close to execution units. While large register files are considered a no-no for performance reasons today, the authors say that in the future when raw frequency is not our key constraint, this could be ok.
The other important interconnect issue is the communication network between different cores on a chip. Today's researchers are largely focused on networks-on-chips where packet switching is used, but Borkar and Chien say this is not energy efficient. Even if just 10% of the operands move 10 hops on the average, the network power could be as much as half of a chip's power budget. The authors advocate the use of hybrid networks-on-chip which use both packet and circuit switching, and say there is tremendous room for innovation in energy-efficient network-on-chip design. Some network-on-chip configurations are shown in the figure above.
Software
Borkar and Chien say that the move to heterogeneous multi-core architectures could bring up "the greatest software challenge in the history of computing". This is because the burden of extracting parallelism and enabling high performance is largely in the hands of the software developer.
Do I agree with the authors' vision of "the future of microprocessors"?
The paper is an interesting one. My main concern with this vision is that it puts much of the burden of getting performance in the hands of software developers, and gives them the hard task of programming for these complex chips. I've played a bit with parallel programming using APIs such as OpenMP. It's really hard! If Intel indeed goes this route, they will stand the risk of customers not seeing enough performance benefits due to the lack of parallelism in software. All this will translate to lower PC growth rates, which is bad for Intel's business.
I also feel microprocessor evolution will be more balanced, with process, device, circuit, architecture and software technologies all sharing the burden and improving performance. I was surprised not to find Finfets, 3D stacking of DRAM, monolithic 3D-ICs and other next-generation technologies covered in this vision for the "future of microprocessors". Borkar and Chien talk about post-silicon CMOS switches made out of carbon nanotubes, graphene and compound semiconductors, but don't discuss Finfets and 3D-IC approaches, which could be a lot more practical.
This being said, I liked the paper. It has many interesting circuit and architecture ideas. Shekhar Borkar plays a key leadership role within Intel's circuit research team, and the points he makes about next-generation circuits are very valid.
Software
Borkar and Chien say that the move to heterogeneous multi-core architectures could bring up "the greatest software challenge in the history of computing". This is because the burden of extracting parallelism and enabling high performance is largely in the hands of the software developer.
Do I agree with the authors' vision of "the future of microprocessors"?
The paper is an interesting one. My main concern with this vision is that it puts much of the burden of getting performance in the hands of software developers, and gives them the hard task of programming for these complex chips. I've played a bit with parallel programming using APIs such as OpenMP. It's really hard! If Intel indeed goes this route, they will stand the risk of customers not seeing enough performance benefits due to the lack of parallelism in software. All this will translate to lower PC growth rates, which is bad for Intel's business.
I also feel microprocessor evolution will be more balanced, with process, device, circuit, architecture and software technologies all sharing the burden and improving performance. I was surprised not to find Finfets, 3D stacking of DRAM, monolithic 3D-ICs and other next-generation technologies covered in this vision for the "future of microprocessors". Borkar and Chien talk about post-silicon CMOS switches made out of carbon nanotubes, graphene and compound semiconductors, but don't discuss Finfets and 3D-IC approaches, which could be a lot more practical.
This being said, I liked the paper. It has many interesting circuit and architecture ideas. Shekhar Borkar plays a key leadership role within Intel's circuit research team, and the points he makes about next-generation circuits are very valid.
RSS Feed
