MonolithIC 3D Inc. has been honored to be invited to give a Key Note at the ITHERM 2014 with a Plenary Talk. Sponsored by the IEEE’s CPMT Society, ITherm 2014 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. THe ITHerm 2014 was an exciting conference with more than 400 attendies.The company's President and CEO, Mr. Zvi Or-Bach gave a planery talk on "Thermal Issues and Alternative Solution Related to ‘Fabrication’ and ‘Operation’ of Monolithic 3D Ics ".
"Semiconductor industry is facing an inflection point: dimensional scaling has reached diminishing returns", noted Mr. Or-Bach in his presentation. "The next decade of progress would be by scaling up with monolithic 3D technology." Or-Bach Key Note presented why monolithic 3D is next path for progress, why dimension scaling had made monolithic 3D practical, presenting details of three process flow for processing monolithic 3D, and finnaly why monolithic 3D present a new heat removal challange and prctical techniques to overcome this thermal challange. You can access the presentation in our company's webpage under Papers and Presentations Menu, or by clicking here.
"Semiconductor industry is facing an inflection point: dimensional scaling has reached diminishing returns", noted Mr. Or-Bach in his presentation. "The next decade of progress would be by scaling up with monolithic 3D technology." Or-Bach Key Note presented why monolithic 3D is next path for progress, why dimension scaling had made monolithic 3D practical, presenting details of three process flow for processing monolithic 3D, and finnaly why monolithic 3D present a new heat removal challange and prctical techniques to overcome this thermal challange. You can access the presentation in our company's webpage under Papers and Presentations Menu, or by clicking here.
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