Monolithic 3D Inc., the Next Generation 3D-IC Company
  • Home
  • Technology
    • Technology
    • Papers, Presentations and Patents
    • Overview >
      • Background
      • Why Monolithic 3D?
      • Paths to Monolithic 3D
      • Applications
    • Ion-Cut: The Building Block
    • Monolithic 3D Logic >
      • RCAT
      • HKMG
      • Laser Annealing
      • RCJLT
      • 3D Embedded RAM
      • 3D Gate Array
      • FPGA
      • Ultra Large Integration - Redundancy and Repair
    • Monolithic 3D Memory >
      • 3D DRAM
      • 3D Resistive Memories
      • 3D Flash
    • Monolithic 3D Electro-Optics >
      • 3D Image Sensors
      • 3D Micro-Displays
  • 3D-IC Edge
    • 3D-IC Edge
  • News & Events
    • News & Events
    • S3S15 Game Change 2.0 Video/P
    • Webcast
    • Webinar
    • Press Releases
    • In the News
    • Upcoming Events
  • About Us
    • About Us
    • History
    • Team
    • Careers
    • Contact Us
  • Blog
  • Simulators

MonolithIC 3D Inc. at IEEE International Conference on 3D System Integration (3D IC)

9/10/2013

0 Comments

 
Picture
Join MonolithIC 3D Inc. at IEEE International Conference on 3D System Integration (3D IC) on October 2nd -4th, 2013 in San Francisco, CA. Zvi Or-Bach, President and CEO of MonolithIC 3D Inc. will present a guest tutorial on 3D IC edge. The company will also give the presentation: “Pulsed Laser Annealing: A scalable and practical technology for monolithic 3D IC” in session VII of the event. You can access the Technical Program of the Conference here.

Zvi Or-Bach, President and CEO of MonolithIC 3D Inc. will be featured as guest speaker to present a tutorial on Monolithic 3D IC. The tutorial describes the advantages of monolithic 3d as an alternative to maintain the exponential increase in integration. Some of the advantages of this technology include reductions of cost, decreases in power consumption, and improvements in performance, and bring some new and compelling benefits like:
  • Continuing reductions in die size and power, 
  • Significant advantages for reusing the same fab line and design tools,
  • Heterogeneous Integration
  • Processing multiple layers simultaneously, offering multiples of cost improvement
  • Logic redundancy, allowing 100x integration at good yields
  • Modular Platforms

“Monolithic 3D is a disruptive semiconductor technology. It builds on the existing infrastructure and know-how, and could bring to the high tech industry many more years of continuous progress. While it provides the advantages that dimensional scaling once provided, monolithic 3D offers many more options and benefits. And the best of all is that it could be done in conjunction with dimensional scaling. Now that monolithic 3D is practical, it is time to augment dimensional scaling with monolithic 3D-IC scaling.”

Even more, the company will also give a presentation in session VII on a new path for monolithic 3D IC: “Pulsed Laser Annealing: A scalable and practical technology for monolithic 3D IC”. This work was done in collaboration with the Department of Electrical Engineering, IIT Bombay, India.

Abstract of presentation: Classical dimensional scaling faces challenges from growing on-chip interconnect time delays, and escalating lithography costs and layout limitations. In this paper, we present practical integration schemes for developing cost-efficient 3D ICs in a monolithic fashion, which employ fully depleted transistor channels and laser annealing to achieve sharper junction definition.

Join us at the most important event in the 3D IC industry held this year in San Francisco, CA on October 2nd - 4th, 2013. Here you can find the registration link and fee information to attend the conference.
submit to reddit
0 Comments

Your comment will be posted after it is approved.


Leave a Reply.

    Search Blog


    Meet the Bloggers


    Follow us


    To get email updates subscribe here:


    Recommended Links

    3D IC Community
    3D IC LinkedIn Discussion Group

    Recommended Blogs

    • 3D InCites by Francoise von Trapp
    • EDA360 Insider by Steve Leibson
    • Insights From the Leading Edge by Phil Garrou
    • SemiWiki by Daniel Nenni, Paul Mc Lellan, et al.

    Archives

    March 2022
    December 2021
    August 2021
    August 2018
    July 2018
    May 2018
    October 2017
    September 2017
    December 2016
    September 2016
    August 2016
    November 2015
    October 2015
    September 2015
    July 2015
    June 2015
    May 2015
    April 2015
    March 2015
    February 2015
    October 2014
    September 2014
    August 2014
    July 2014
    June 2014
    May 2014
    April 2014
    March 2014
    February 2014
    January 2014
    December 2013
    November 2013
    October 2013
    September 2013
    August 2013
    July 2013
    March 2013
    February 2013
    January 2013
    December 2012
    November 2012
    October 2012
    August 2012
    June 2012
    May 2012
    April 2012
    March 2012
    February 2012
    January 2012
    December 2011
    November 2011
    October 2011
    September 2011
    August 2011
    July 2011
    June 2011
    May 2011
    April 2011
    March 2011

    Categories

    All
    3d Design And Cad
    3dic
    3d Ic
    3d Nand
    3d Stacking
    3d Technology
    Brian Cronquist
    Dean Stevens
    Deepak Sekar
    Dram
    Education
    Heat Removal And Power Delivery
    Industry News
    Israel Beinglass
    Iulia Morariu
    Iulia Tomut
    Monolithic3d
    Monolithic 3d
    MonolithIC 3D Inc.
    Monolithic 3d Inc.
    Monolithic 3d Technology
    Moore Law
    Outsourcing
    Paul Lim
    Repair
    Sandisk
    Semiconductor
    Semiconductor Business
    Tsv
    Zeev Wurman
    Zvi Or Bach
    Zvi Or-Bach

    RSS Feed

© Copyright MonolithIC 3D Inc. , the Next-Generation 3D-IC Company, 2012 - All Rights Reserved, Patents Pending