"We moved to 3D starting with Trigate (FinFET) at 22 nm node, but an even better example is our announcement in May of a 96-layer, 4-bit-per-cell NAND flash that packs up to 1 terabit of information per die. This is a true post-Dennard example of packing increasing functions into a die without feature scaling. Over time, we expect logic to also move more toward 3D." [read full article]