While much of the article rings completely true, ...
"... There are fears that IC scaling is becoming too costly for most chip makers-or will end in the distant future.
So instead of scaling, there is another concept on the table: stack and connect devices in a 3-D configuration..."
I wish that they had expanded the discussion beyond TSVs. While Through Silicon Vias are currently a mainstream solution, our solution better addresses multiple issues with alignment, die area, thermal expansion and capacitance.
- post by Dean Stevens, MonolithIC 3D VP of Marketing