Gary presented the chart below presenting the 1,000x challenge to the semiconductors industry.
This could explain the adoption of hybrid bonding as a core technology by multiple Chinese corporations. Hybrid bonding allows them to replace dimensional node scaling with system-level 3D scaling.
In August 2018, YMTC officially launched its ground-breaking Xtacking® architecture at the Flash Memory Summit, and won the “Best of Show” award. For its 3D NAND product, it uses two semiconductor manufacturing lines, one for the 3D NAND multi-level memory, and one for the peripheral (memory control) circuits as illustrated in Fig. 3 below.
The paper rightly points out that for AI computing data transfer dominates the system performance and power consumption. Consequently, overcoming the “Memory Wall” is key for AI computing and even more so with the rapid escalation of the size of the AI model computation requirements as illustrated in Fig. 6 below.