There are a couple of interesting meetings coming up in the next several weeks that highlight one of the questions that has been lurking around the 3D movement for as long as I can remember. One group, that is well represented by the discussion at these meetings, sees 3D as a packaging issue. Perhaps that's why the IEEE CPMT-SV is such an active sponsor of these discussions:
Zvi Or-Bach, our Founder and CEO was interviewed by Debra Vogler, Senior Technical Editor at ElectroIQ for an article titled "3D IC is only solution for scaling "up," says MonolithIC 3D exec"
EETimes published a nice article highlighting the "rise" (hey, an EETimes joke) of die stacking.
While much of the article rings completely true, ...
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