Monolithic 3D Inc., the Next Generation 3D-IC Company
  • Home
  • Technology
    • Technology
    • Papers, Presentations and Patents
    • Overview >
      • Background
      • Why Monolithic 3D?
      • Paths to Monolithic 3D
      • Applications
    • Ion-Cut: The Building Block
    • Monolithic 3D Logic >
      • RCAT
      • HKMG
      • Laser Annealing
      • RCJLT
      • 3D Embedded RAM
      • 3D Gate Array
      • FPGA
      • Ultra Large Integration - Redundancy and Repair
    • Monolithic 3D Memory >
      • 3D DRAM
      • 3D Resistive Memories
      • 3D Flash
    • Monolithic 3D Electro-Optics >
      • 3D Image Sensors
      • 3D Micro-Displays
  • 3D-IC Edge
    • 3D-IC Edge
  • News & Events
    • News & Events
    • S3S15 Game Change 2.0 Video/P
    • Webcast
    • Webinar
    • Press Releases
    • In the News
    • Upcoming Events
  • About Us
    • About Us
    • History
    • Team
    • Careers
    • Contact Us
  • Blog
  • Simulators

DARPA calls for >50x improvement in SoC using Monolithic 3D – 3DSoC

10/2/2017

0 Comments

 
Picture
We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc.
A technology that could bridge the processor memory gap, Monolithic 3D has DARPA's attention. The agency wants proposals by Nov 6. Learn more at an upcoming IEEE conference.

On Sept 13 the Defense Advanced Research Projects Agency (DARPA) launched a giant funding effort to ensure the United States will sustain the pace of electronic innovation vital to both a flourishing economy and a secure military. Under the banner of the Electronics Resurgence Initiative (ERI), some $500-$800 million will be invested in post-Moore’s law technologies.

Among those is the 3DSoC program. “The overall goal of the Three Dimensional Monolithic System-on-a-Chip (3DSoC) program" DARPA wrote in a statement, "is to develop 3D monolithic technology that will enable > 50X improvement in SOC digital performance at power. 3DSoC aims to drive research in process, design tools, and new compute architectures for future designs while utilizing U.S. fabrication capabilities.” As is illustrated in the following chart:
Picture
The foundation for the 3DSoC program were formed in prior DARPA research work performed by Stanford University in collaboration with Berkeley and CMU, Energy-Efficient Abundant-Data Computing: The N3XT 1,000×
The underlying problem enabling these orders of magnitude improvement is often called “The Memory Wall” illustrated by the following chart from Hennessy and Patterson:
Picture
The main source of the gap is the limited number of long wires connecting memory to processor. This is driven by the fact that typically the process line for memory is very different than of processor, resulting in memory chips aggregated to memory modules and being connected to the processor using printed circuit board or, at best, carrier substrate. A technology that could bridge this gap — Monolithic 3D — has the potential to provide more than 1,000x better computers.

DARPA kept the target enhancement to only 50x to allow use of chip manufactured in domestic older fab (~90nm) instead of off-shore 7nm fab lines.

Proposals are due by Nov 6, allowing everyone a unique opportunity to hear an invited talk about the program on October 16 from the 3DSoC DARPA Program Manager, Dr. Linton Salmon during this year’s IEEE S3S 2017 at the Hyatt Regency at the San Francisco Airport. The IEEE S3S conference is dedicated to monolithic 3D technologies. It provides unparalleled opportunity for quick catch up with the broad spectrum of monolithic technologies.

At the conference’s start Al Fazio, Intel Senior Fellow, will deliver a plenary talk on how 3D NAND and 3D XPoint ended being the trailblazing monolithic 3D IC technologies that have matured to volume production, taking over the fast growing memory market. The first day will conclude with two 3D IC focus sessions comprised of a mix of invited and submitted papers covering exotic technologies and the use of the emerging nano-wire transistors for 3D scaling.

The first half of the second day includes a collaborative event organized by Qualcomm and CEA Leti — the COOLCUBE/3DVLSI Open Workshop. The second half includes an open 3D tutorial providing full coverage of the various 3D integration technologies from TSV to Sequential Integrations. 

The third day is made of four sessions of invited and submitted talks on monolithic and other forms of 3D integration. These sessions include a talk by MonolithIC 3D Inc. in which we will present a monolithic 3D technology that is ready to be rapidly deployed using the current transistor process. We will also describe how such an integration technology could be used to improve performance, reduce power and cost of most computer systems, suggestive of a 1,000x total system benefit.

In addition, the IEEE S3S conference includes full coverage of SOI and low-power technologies, making it the place to be and to learn about alternative technologies to dimensional scaling. I am looking forward to seeing you at the S3S from October 16th thru 19th, 2017.
​

submit to reddit
0 Comments

Your comment will be posted after it is approved.


Leave a Reply.

    Search Blog


    Meet the Bloggers


    Follow us


    To get email updates subscribe here:


    Recommended Links

    3D IC Community
    3D IC LinkedIn Discussion Group

    Recommended Blogs

    • 3D InCites by Francoise von Trapp
    • EDA360 Insider by Steve Leibson
    • Insights From the Leading Edge by Phil Garrou
    • SemiWiki by Daniel Nenni, Paul Mc Lellan, et al.

    Archives

    March 2022
    December 2021
    August 2021
    August 2018
    July 2018
    May 2018
    October 2017
    September 2017
    December 2016
    September 2016
    August 2016
    November 2015
    October 2015
    September 2015
    July 2015
    June 2015
    May 2015
    April 2015
    March 2015
    February 2015
    October 2014
    September 2014
    August 2014
    July 2014
    June 2014
    May 2014
    April 2014
    March 2014
    February 2014
    January 2014
    December 2013
    November 2013
    October 2013
    September 2013
    August 2013
    July 2013
    March 2013
    February 2013
    January 2013
    December 2012
    November 2012
    October 2012
    August 2012
    June 2012
    May 2012
    April 2012
    March 2012
    February 2012
    January 2012
    December 2011
    November 2011
    October 2011
    September 2011
    August 2011
    July 2011
    June 2011
    May 2011
    April 2011
    March 2011

    Categories

    All
    3d Design And Cad
    3dic
    3d Ic
    3d Nand
    3d Stacking
    3d Technology
    Brian Cronquist
    Dean Stevens
    Deepak Sekar
    Dram
    Education
    Heat Removal And Power Delivery
    Industry News
    Israel Beinglass
    Iulia Morariu
    Iulia Tomut
    Monolithic3d
    Monolithic 3d
    MonolithIC 3D Inc.
    Monolithic 3d Inc.
    Monolithic 3d Technology
    Moore Law
    Outsourcing
    Paul Lim
    Repair
    Sandisk
    Semiconductor
    Semiconductor Business
    Tsv
    Zeev Wurman
    Zvi Or Bach
    Zvi Or-Bach

    RSS Feed

© Copyright MonolithIC 3D Inc. , the Next-Generation 3D-IC Company, 2012 - All Rights Reserved, Patents Pending