In The News

Technology

A 1000× Improvement of the Processor-Memory Gap
06/09/2020 | NANO-CHIPS 2030, Springer
​
​Monolithic 3D Integration—An Update
06/09/2020 | NANO-CHIPS 2030, Springer

High-Speed 3D Memories Enabling the AI Future
06/09/2020 | NANO-CHIPS 2030, Springer

3D for Efficient FPGA
06/09/2020 | NANO-CHIPS 2030, Springer

EV Group accelerates 3D-IC packaging roadmap with breakthrough wafer bonding technology
07/03/2018 | Solid State Technology Magazine  ​

Paths to superfast 3D Chips​
nextBIG FUTURE | 10/23/2017
MonolithIC 3D Inc. in the news.

Monolithic 3D Shows Promise, Challenges
EE Times | 10/23/2017
MonolithIC 3D Inc. in the news.

​A 1,000x improvement in computer systems using current fabs and process
​Solid State Technology Magazine | 10/13/2017
Solid State Magazine sharing our latest blog post. 
​
DARPA Calls For 50X Improvement in SoC​
EE Times | 10/12/2017
EE Times sharing our latest blog post.

IEEE S3S 2017 Showcases
Monolithic 3D Technologies
EE Times | 10/02/2017
EE Times sharing our latest blog post.

DARPA calls for Monolithic 3D – 3DSoC
Solid State Technology Magazine | 09/19/2017
MonolithIC 3D Inc. in the news.

A year in review: Top 10 stories of 2016
Solid State Technology Magazine | 12/23/2016
MonolithIC 3D Inc. in the news.

Moore’s Law did indeed stop at 28nm
Solid State Technology Magazine | 09/19/2016
Solid State Magazine sharing our latest blog post. 
 
Transistor Trick Beats Moore, Cheaper Chip Nodes Improved
EE Times | 09/14/2016
EE Times sharing our latest blog post. 
​
28nm Was Last Node of Moore's Law
EE Times | 08/29/2016
EE Times sharing our latest blog post.

Global 3D ICs Market to Log 18.1% CAGR till 2019 with Growing Demand from Consumer Electronics and ICT Industries
Industry Today | 01/22/2016
MonolithIC 3D Inc. in the news.

Monolithic 3D Poses Challenges for Test
3D InCites | 10/14/2015
MonolithIC 3D Inc. in the news.

Is HW or SW Running The Show?
Semiconductor Engineering | 09/24/2015
MonolithIC 3D in the news.
​
Monolithic 3D - Game-Changing 2.0 at IEEE S3S
Solid State Magazine | 10/07/2015
Solid State Magazine sharing our latest blog post. 

Monolithic 3D Ready to Give IoT its Own Scaling Path
EE Times Magazine | 09/26/2015
EE Times sharing our latest blog post. 

S3S - The Conference for IoT Technologies
Solid State Magazine | 09/18/2015
MonolithIC 3D in the news.

IoT is About Older Nodes, Cheaper Dev
EE Times | 09/09/2015
EE Tims sharing our latest blog post.

Electronics Butterfly Effect
Semiconductor Engineering Website | 08/25/2015
MonolithIC 3D in the news.

SEMICON West: The road forward is 3DIC
Solid State Technology Magazine | 07/30/2015
Solid State Magazine sharing our latest blog post. 


Semicon West: The Roadmap is 3D IC
EE Times | 07/22/2015
EE Times sharing our latest blog post.

Intel -- The Litmus Test
EE Times | 06/22/2015
MonolithIC 3D Inc. in the news.

Moore's Law to keep on 28nm
Solid State Magazine | 05/13/2015
MonolithIC 3D Inc. in the news. 

Moore's on at 28nm
Design & Reuse | 05/07/2015
MonolithIC 3D Inc. in the news.

Moore's on at 28nm 
EE Times | 05/05/2015
MonolithIC 3D Inc. in the news.

Leveraging Monolithic 3D Will Help Qualcomm Compete With MediaTek
Seeking Alpha | 04/23/2015 
Monolithic 3D Inc. in the news.

Qualcomm to Leverage Monolithic 3D for Smartphones
EE Times | 04/17/2015 
Monolithic 3D Inc. in the news.    

Intel proposes 3D integration for next-gen SoCs
EE Times | 03/06/2015 
Monolithic 3D Inc. in the news. 
     
Intel proposes 3D integration for next-gen SoCs
Simm Tester | 03/09/2015 
Monolithic 3D Inc. in the news.

Intel Calls for 3D IC 
EE Times | 03/05/2015
EE Times published our latest blog post.

Dark Silicon -- Are the Dark Days Coming?
EE times | 06/02/2015 
MonolithIC 3D in the news. 

Chip Options Sought as Costs Rise    
EE Times Magazine | 10/08/2014
MonolithIC 3D Inc. in the news. 

Monolithic 3D breakthrough at IEEE S3S 2014
Solid State Magazine | 09/10/2014
Solid State Magazine published our latest blog post. 

Game-Changing Breakthrough at IEEE S3S 2014
EE TImes | 09/10/2014
EE Times published our latest blog post. 

SST Article details Leti’s MonolithIC 3D presentation at Semicon West ’14
Advanced Substrate News | 09/01/2014
MonolithIC 3D Inc. in the news.

Intel vs. Intel
08/1/2014 | EE Times
EE Times published our latest blog post.

CEA-Leti: Monolithic 3D is the solution for further scaling
07/22/2014 | Solid State Magazine
Solid State Magazine published our latest blog post.

Paradigm shift in semi equipment – Confirmed
07/15/2014 | Solid State Magazine
Solid State Magazine published our latest blog post.

Monolithic 3D: A Disruptive Approach for Further Scaling
07/14/2014 | EE Times
EE Times shared our latest blog post.

Fusion Bonding for Next-Generation 3D-ICs
07/14/2014 | Solid State Technology
MonolithIC 3D in the news.

Monolithic 3DIC for SoC
07/14/2014 | Tech Design Forum
MonolithIC 3D in the news.

14nm, 7nm, 5nm: How low can CMOS go? It depends if you ask the engineers or the economists…
06/23/2014 | Extreme Tech Magazine
Extreme Tech Magazine sharing our latest blog post.  

Qualcomm Calls for Monolithic 3D IC
06/17/2014 | EE Times 
EE Times sharing our latest blog post. 

Qualcomm: Scaling down is not cost-economic anymore – so we are looking at true monolithic 3D
06/16/2014 | Solid State Technology Magazine
Solid State Technology Magazine sharing our latest blog post. 

FPGAs as ASIC Alternatives: Past & Future
04/21/2014 | EE Times
EE Times sharing our latest blog post. 

28nm the end of Moore's Law?
03/25/2014 | The Guru of 3D 
The Guru of 3D website shared our latest blog post. 

28nm – The last node of Moore's law
03/24/2014 | EE Times Europe
EE Times Europe shared our latest blog post. 

28nm - The Last Node of Moore's Law
03/25/2014 | News Locker
News Locker shared our latest blog post. 

Is 28nm the end of Moore's Law?
03/24/2014 | Dark Vision Hardware 
Dark Vision Hardware wrote an article on our latest blog post. 

28nm - The Last Node of Moore's Law
03/25/2014 | Heresalink website
Heresalink website shared our latest blog post. 

The end of Moore’s Law may already be here
03/25/2014 | Geek website 
Geek website published an article based on our latest blog post. 

Moore’s Law Already Dead?
03/24/2014 | Data Center Journal
Data Center Journal wrote an article on our latest blog post.

28nm node at the final frontier of Moore's Law
03/20/2014 | EE Times Asia 
EE Times Asia sharing our latest blog post. 

28nm - The Last Node of Moore's Law
03/20/2014 | Brunch News
Brunch News sharing our latest blog post. 

Viewpoint: 28nm chips mark the end of Moore's Law
03/20/2014 | SmartBrief
SmartBrief website sharing our latest blog post. 

Moore's Law is coming to an end
03/20/2014 | PhoneArena website
PhoneArena Website sharing our latest blog post. 

28nm – The Last Node of Moore's Law
03/19/2014 | EE Times
EE Times Magazine published our latest blog post. 

28 nm - The Last Node of Moore's Law
03/18/204 | Design and Reuse
Design and Reuse published our latest blog post.

Moore’s Law has stopped at 28nm!
03/04/2014 | Solid State Magazine
Solid State Magazine shared our latest blog post.

Why 450mm Will Be Pushed-Back Even Further
02/28/2014 | EE Times
EE Times published our latest blog post. 

The Rise of the Monolithic 3-D chip
02/25/2014 | I-Micronews 
MonolithIC 3D Inc. in the news.
 
The most expensive SRAM in the world – 2.0
02/23/2014 | Solid State Magazine
Solid State Magazine published our latest blog post. 

Will monolithic 3D IC technology become a real competitor to 3DIC with TSV?
01/30/2014 | Solid State Magazine
MonolithIC 3D Inc. in the news (page 9).

Paradigm Shift - Semi Equipment Tells the Future
01/29/2014 | Design & Reuse
Our latest blog post was published by Design & Reuse.

Paradigm shift: Semi equipment tells the future
01/29/2014 | Solid State Magazine
Our latest blog post was published by Solid State Magazine.

IFTLE 177 Monolithic 3DIC ; Merck acquires AZEM; Intel Invests in SBA Materials; Xilinx Semi Award
01/22/2014 | Solid State Magazine
MonolithIC 3D Inc. in the news. 

Intel vs. TSMC: An Update
01/22/2014 | Solid State Magazine
Our latest blog post was published by Solid State Magazine. 

3DIC market to reach $7.52B by 2019
01/17/2014 | Solid State Magazine
MonolithIC 3D Inc. in the news. 

Why SOI is the Future Technology of Semiconductor
01/14/2014 | SemiWiki.com
SemiWiki.com website sharing our latest blog post. 

Blog review December 23, 2013
12/23/2013 | Semiconductor Manufacturing and Design
Semiconductor Manufacturing and Design review of our latest blog post.

Why SOI is the Future Technology of Semiconductors
12/23/2013 | Semiconductor Manufacturing and Design
Semiconductor Manufacturing and Design sharing our latest blog post. 

Monolithic 3D IC: an Emerging Technology to Keep Us on Moore's Law
12/18/2013 | GSA Forum
GSA Forum article about MOnolithIC 3D Inc. 

Momentum Builds for Monolithic 3D ICs
12/16/2013 | EE Times
EE Times sharing our latest blog post.

Monolithic 3D IC Technologies
11/28/2013 | EE Times
MonolithIC 3D Inc. in the news on EE Times website.

Can Intel Beat TSMC?
11/26/2013 | Design & Reuse
Design & Reuse shared our latest blog post.

Can Intel beat TSMC?
11/25/2013 | Solid State Technology Magazine
Our blog post was published by Solid State Technology Magazine.

Momentum Builds For Monolithic 3D ICs
11/14/2013 | Semiconductor Engineering
MonolithIC 3D Inc. in the news.

Are we using Moore’s name in vain?
Semiconductor Manufacturing & Design Community | 11/11/2013
Our latest blog post was published by Semiconductor Manufacturing & Design Community.

Are we using Moore’s name in vain?
11/06/2013 | Solid State Magazine
Our latest blog post shared by Solid State Magazine.

Scaling makes monolithic 3D IC practical
10/21/2013 | Solid State Magazine
Our blog post was shared by Solid State Magazine. 

MonolithIC 3D Inc. at the 2013 IEEE 3DIC Conference
09/27/2013 | HispanicBusiness.com
Our latest press release sherd by HispanicBusiness.com

3D-IC: Two for one
09/25/2013 | Solid State Magazine
Our latest blog post shared by Solid State Magazine.

Moore's Law Dead by 2022" - Then, Before or ....
09/04/2013 | Design and Reuse
Our latest blog post shared by Design and Reuse.

Moore's Law Dead by 2022: Crying Wolf?
08/30/2013 | Solid State Magazine
Our latest blog post shared by Solid State Magazine. 

Three Dimensional ICs in Smartphones
08/09/2013 | Engineering.com
MonolithIC 3D Inc. in the news.

Monolithic 3D is now in production: Samsung starts mass production first 3D vertical NAND flash
08/03/2013 | Solid State Magazine 
Our latest blog post shared by Solid State Magazine. 

EUV vs TSV: Which one will become production ready first?
07/31/2013 | Wesrch website
Our blog post shared by Wesrch website. 

Monolithic 3D is now on the roadmap for 2019
08/01/2013 | Solid State Magazine
Our blog post shared by Solid State Magazine.

EUV vs TSV: Which one will become production ready first?
07/31/2013 | Solid State Magazine
Our latest blog post shared by Solid State Magazine.

ASML at Semicon West 2013: SRAM scaling has stopped!
07/18/2013 | Solid State Magazine
Solid State Magazine has published our latest blog post. 

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success
04/18/2013 | Electronics WeSrch
Our latest press release shared by Electronics WeSrch website.

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success
04/18/2013 | redOrbit
Our latest press shared by redOrbit webpage.

MonolithIC 3D Inc. Announces its Advisory Board Members
04/03/2013 | Digital Journal
Our latest press release shared by Digital Journal.

Blog: Dimensional scaling and the SRAM bit-cell
03/21/2013 | Solid State Technology
Solid State Technology Magazine sharing our latest blog post.

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology
03/18/2013 | Red Orbit
Red Orbit website sharing our company's latest press release.

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology
03/18/2013 | EE Times India 
EE Times sharing our company's latest press release.

IEDM 2012: The pivotal point for monolithic 3D ICs
01/29/2013 | Solid State Technology
Solid State Technology Magazine sharing our latest blog post.

MonolithIC 3D Inc. Shows 3D-ICs Can Be Effectively Cooled
01/20/2013 | Embedded Computing Design
Embedded Computing Design Magazine sharing our latest press release.

Moore's Law Scaling Stymied at 14nm?
01/15/2013 | HPC wire
HPC wire website's article on our blog piece. 

Moore’s Law seen hitting big bump at 14 nm
01/11/2013 | EE Times 
EE Times sharing our company's blog post, the point of view of Zvi O-Bach, Founder and CEO of MonolithIC 3D Inc.

Tying up 2012 3D IC Loose Ends
01/04/2012 | 3D InCites
Francoise Von Trapp writing about our blog post.

IEDM goes deep on 3-D circuits
12/10/2012 | EE Times
EE Times article about our participation  at IEDM. 

MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology
12/05/2012 | RedOrbit 
RedOrbit website sharing our press release.

3D Company Updates
12/05/2012 | 3D InCites
Francoise Von Trapp writing about our press release.

Virtual Strategy Magazine: MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology
12/04/2012 | Virtual Strategy Magazine
Our press release was covered by Virtual Strategy Magazine.

Qualcomm overtakes Intel in market capitalization
11/20/2012 | EE Times 
EE Times sharing our company's latest blog post, the point of view of Zvi O-Bach, Founder and CEO of MonolithIC 3D Inc.

Focus on monolithic 3D-ICs paradigm shift for semicon industry
11/19/2012 | Pradeep Chakraborty's Blog
Pradeep Chakraborty's Blog Post about MonolithIC 3D Inc.

MonolithIC 3D Assigned Patent
29/10/2012 | TMCnet.com
TMCnet.com writing about Monolithic 3D IC's Patents.

Soitec leverages core technologies to address wafer-level 3D integration

Monolithic 3D IC Technologies
07/20/2012 | All Programmable Planet
All Programmable Planet's article about Monolithic 3D ICs technology. 

Is the cost reduction associated with IC scaling over?
07/16/2012 | EE Times
EE Times sharing our blog post about cost reduction associated with scaling.

SEMICON West 2012 exhibits preview: Lithography focus
06/27/2012 | Solid State Technology
Solid State Technology Insights for Electronics Manufacturing describing our technology. 

Is the Cost Reduction Associated with Scaling Over?
06/21/2012 | Design & Reuse
Industry Expert Blogs sharing our latest blog post.

Embedded Computing Design Selects Top Innovators in Embedded Design
06/15/2012 | Embedded Computing Design
Embedded Computing Design's article about Zvi Or-Bach's award.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine
06/13/2012 | Virtual-Strategy Magazine
Virtual-Strategy Magazine sharing our press release.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine
06/13/2012 | Digital Journal
Digital Journal sharing our press release.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine
06/13/2012 | Digital Journal
Digital Journal sharing our press release.

2012 Top Embedded Innovator – Silicon: Zvi Or-Bach, Founder and CEO, MonolithIC 3D
06/04/2012 | Designer 3d Glasses
Designer 3D Glasses sharing the news about Zvi Or-Bach, Founder and CEO of MonolithIC 3D Inc.'s Award.

2012 Top Embedded Innovator - Silicon: Zvi Or-Bach, Founder and CEO, MonolithIC 3D (Front Cover)
06/04/2012 | Embedded Computing Design
Embedded Computing Design's article about Zvi Or-Bach, the Founder and CEO of MonolithIC 3D Inc.

Intel vs. the Foundries: where is advanced logic heading?
06/04/2012 | Design & Reuse
Industry Expert Blogs sharing our latest blog post.

MonolithIC 3D Inc., a Finalist at Semicon West 2011, Announces its Return to the 2012 Event
05/31/2012 | Virtual-Strategy Magazine
Our press release was covered by Virtual-Strategy Magazine on May 31st, 2012.

MonolithIC 3D Inc., a Finalist at Semicon West 2011, Announces its Return to the 2012 Event
05/31/2012 | Digital Journal
Our press release shared by Digital Journal on May 31st.

The Future is the Interconnect: IITC
05/21/2012 | Design & Reuse
Industry Expert Blogs sharing our blog post about IITC on May 21st, 2012.

Reversal from the foundry model back to IDM?
05/16/2012 | Future Fab Magazine
Our blog post was covered by Future Fab Magazine.

Reversal from the foundry model back to IDM ?
05/11/2012 | EE Times
Our blog post was covered by EE Times.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
04/25/2012 | Digital Journal
Our press release was covered by Digital Journal.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
04/25/2012 | IT Business Net
Our press release was covered by IT Business Net.


MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
04/25/2012 | Designer 3D Glasses
Our press release was covered by Designer 3D Glasses.

TSV when mass production?
04/13/2012 | EE Times Taiwan
Our blog post was covered by EE TImes Taiwan on April 13th, 2012.

Viewpoint: Is TSV for real?
04/09/2012 | EE Times
Our blog post was covered by EE Times on April 9th, 2012

Is NVIDIA in a Panic? If so, what about AMD? Other fabless companies?
04/02/2012 | Design and Reuse
Industry Expert Blogs sharing our blog post about NVIDIA

Could 3d chip technology extend Moore's law to 2030?
03/30/2012 | Next Big Future
Interview for the Next Big Future's website with Zvi Or-Bach, CEO of MonolithIC 3D Inc.


MonolithIC 3D Inc.'s 2D and 3D-ICs Simulator Tool is a Worldwide Hit
03/28/2012 | Virtual-Strategy Magazine
Our press release was covered in Virtual-Strategy Magazine.


MonolithIC 3D Inc. Granted Fundamental Patents on 3D-ICs for Logic and Memory Applications
02/06/2012 | UAA Today
News article about our press release in UAA Today's.

Monolithic 3D: A Basic Primer
01/30/2012 | 3D InCites
Press coverage about our technology in 3DIncites's webpage.

The Why and How of Fine-Grain 3D Integration
01/23/2012 | Design & Reuse
Industry Expert Blogs sharing our blog post about Fine-Grain 3D Integration.

Is 3D IC Packaging Ready For Prime Time?
12/28/2011 | Electronic Design
Press coverage about our technology in Electronic Design Magazine.

Overview of Monolithic 3D Integration solutions for 3D flash memories
12/13/2011 | I-Micronews
Press coverage about our monolithic 3d flash memories in I-Micronews.

Do Foundries Have Too Much Power?
12/12/2011 | Design & Reuse
Our blog post was covered by the Design and Reuse

MonolithIC 3D Issued 5th Patent on 3D IC Technology
12/10/2011 | Euroasia Semiconductor
Our press release was covered in Euroasia Semiconductor Magazine.

3D Thursday: Is 2.5D IC assembly “buzz-worthy”?
12/08/2011 | EDA360 Insider
Our blog post was covered by the EDA360 Insider blog. 

Is the Buzz around Xilinx's 2.5D FPGA Justified?
12/05/2011 | Design&Reuse
Press coverage about Deepak Sekar's latest blog post.

What can 20MW Exascale computers teach us about SoC Realization?
11/29/2011 | EDA360 Insider
Steve Leibson's article on Deepak Sekar's blog post about  "The Dally-nVIDIA-Stanford Prescription for Exascale Computing".

3D chips: The next electronics revolution
11/02/2011 | Computerworld

Press coverage about our VP of Technology, Brian Cronquist in Computerworld

Perspectives on Low Temperature Wafer Direct Bonding for Monolithic 3D Integration
10/27/2011 | Semiconductor Packaging News
Our blog post was covered by Semiconductor Packaging News.

Perfecting the 3-D chip
10/11/2011 | EE Times
Press coverage about Zvi Or-Bach, CEO of MonolithIC 3D Inc.

The real cost in the move to 450mm wafers
10/05/2011 | Electronics News 
Electronics News's article on Deepak Sekar's blog post about 450nm wafers.

Interconnect Power II
10/03/2011 | Chip Design Magazine
Chip Design Magazine's article based on Deepak Sekar's blog post on analyzing Intel’s 22 nm FinFET technology versus a hypothetical planar 22nm CMOS technology.

Can 450nm Decommoditize the Semiconductor Industry?
10/03/2011 | Design & Reuse
Industry Expert Blogs sharing Deepak Sekar's blog post about 450nm wafers.

Overcoming direct source-drain tunnelling limitations for CMOS transistors
09/27/2011 | Electronics News Australia
Electronics News Australia's cover story of the magazine about Deepak Sekar's blog post.

Viewpoint: What lies ahead for on-chip interconnect technology?
09/19/2011 | EETimes
EETimes published our blog post. 

Future Horizons forum focuses on 'new rules'
09/15/2011 | EETimes
EE Times article about The International Electronics Forum. Among the forum's speakers there is  Zvi Or-Bach, CEO MonolithIC 3D.

3D ICs without TSVs?
08/31/2011 | EDN
Electronic Design News (EDN)'s article about the ion cutting process

Viewpoint: Will tri-gate play key role in Intel-ARM tussle?
08/09/2011 | EETimes
EE Times article about our viewpoint for fabricating three-dimensional ICs which differs from Intel's tri-gate technology.

MonolithIC 3D - Best of West Finalist Suggests Scaling "Up" with 3D
07/10/2011 | Semicon West Daily
Semicon West's profile of our company

Solid State Technology and SEMI Announce 2011 “Best of West” Award Finalists 
07/06/2011 | SEMI
An announcement that MonolithIC 3D Inc. was selected as one of three finalists for the "Best of Semicon West" Award

NCCAVS on 3D Packaging: Bring on the TSVs
06/20/2011 | ElectroIQ
Press coverage of MonolithIC 3D Inc.'s presentation at the NCCAVS 3D Packaging Workshop. Presentation discussed our Monolithic 3D DRAM   Technology. Available here.

Moore's Law, the bifurcation of the semiconductor industry and 3-D integration
06/16/2011 | EETimes
An opinion piece in EETimes by Israel Beinglass, the CTO of MonolithIC 3D Inc.

Monolithic 3D offers IC power simulator
06/08/2011 | EETimes
Describes IntSim v2.0, an open-source 2D and 3D chip simulator released by MonolithIC 3D Inc.

3D integration: different approaches for different goals
05/2011|Semiconductor Manufacturing
A write-up on different approaches to 3D-ICs, where MonolithIC 3D Inc.'s approaches are described.

Monolithic 3D Integrated Circuits
04/27/2011| Future Fab International
"A description of monolithic 3D-ICs, which offer through-silicon connections with 10,000 times the areal density of TSV technology."  Written by several members of the MonolithIC 3D core team.

3D IC is only solution for scaling "up," says MonolithIC 3D exec
04/24/2011|  Advanced Packaging eNewsletter
"Zvi Or-Bach, MonolithIC 3D, describes the TSV-beating monolithic IC fab process, and argues for scaling "up" rather than down. Or-Bach compares the costs of further semiconductor scaling to advanced packaging." (links to the ElectroIQ article)

Required change in EDA vendors’ role and reward vs. scaling yield
04/19/2011| EETimes
EETimes published Zvi Or-Bach's thought provoking Viewpoint piece calling on EDA vendors to share the risks/rewards from providing tools that improve yields at the more aggressive process nodes.

Timing is Everything... the concept of the 3D-IC has been around for decades, so why now?!
04/12/2011| ChiPortal
ChiPortal picked up, and republished Zvi Or-Bach's excellent blog post "Timing is Everything" that details why this is the era of monolithic 3D ICs.

3D IC is the only solution for scaling "UP", says MonolithIC 3D exec
3/31/2011| ElectroIQ
A description of MonolithIC 3D Inc.'s technology and a podcast interview with Zvi Or-Bach, the company's CEO

Chip Spotlight: Monolithic 3D-ICs
3/1/2011 | Malcolm Penn's column 
A perspective on Monolithic 3D-ICs and MonolithIC 3D Inc. (NuPGA) from Malcolm Penn, the Founder and CEO of Future Horizons.

Moore's law could enter the fourth dimension, via the third
12/23/2010 | EE Times 
An opinion piece by Zvi Or-Bach, President and CEO of MonolithIC 3D Inc. (NuPGA).

Startup outlines monolithic 3D chips
12/09/2010 | EETimes
Press coverage of a MonolithIC 3D Inc. (NuPGA) invited presentation at the 2010 3D-ASIP conference. Presentation discussed approaches to construct monolithic 3D-ICs, and is available here.

ASIC pioneer reinvents 3D FPGAs
01/29/2010 | EETimes
Press coverage of a MonolithIC 3D Inc. (NuPGA) invited presentation at the 2010 Applied Materials Technical Symposium on 3D Interconnect. Presentation discussed monolithic 3D FPGA technology. Available here.

Community

How to Create American Jobs
10/03/2011 | The Huffington Post
The Huffington Post's article about Zvi Or Bach, CEO at MonolithIC 3D Inc.

Zvi Or Bach President & CEO of MonolithIC 3D is now a member of Partnership for a New American Economy
08/30/2011 | Partnership for a New American Economy
Partnership for a New American Economy

Press Releases

Technology

MonolithIC 3D Inc. at the 2013 S3S Conference
10/03/2013

MonolithIC 3D Inc. at the 2013 IEEE 3DIC Conference
09/25/2013

3D-IC LinkedIn Group Has Now over 2,000 Members
07/22/2013

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success
04/18/2013

MonolithIC 3D Inc. Announces its Advisory Board Members
04/03/2013

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology
03/13/2013

MonolithIC 3D Inc. Shows 3D-ICs Can Be Effectively Cooled
12/17/2012

MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology
12/04/2012

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine
06/13/2012

MonolithIC 3D Inc., a Finalist at Semicon West 2011, Announces its Return to the 2012 Event
05/31/2012

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
04/25/2012

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulator Tool is a Worldwide Hit
03/28/20212

MonolithIC 3D Inc. Announces Milestone with Website and Blog
03/21/2012

MonolithIC 3D Inc. Issued Patents on 3D FPGAs and 3D Memories
02/29/2012

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Finalist for EETimes’ Innovator of the Year Award
02/28/2012

MonolithIC 3D Inc. to Present Invited Paper at IEEE 3D IC Conference
01/26/2012

MonolithIC 3D Inc. Announces Yield Repair Scheme for Wafer-Level 3D-ICs
01/24/2012

MonolithIC 3D Inc. Announces Ultra-Scale Integration Scheme
12/20/2011

MonolithIC 3D Inc. Announces 3D NAND Flash Memory Solution with Monocrystalline Silicon
12/15/2011

MonolithIC 3D Inc. Issued 5th Patent on 3D IC Technology
11/30/2011

MonolithIC 3D Inc. Granted Fundamental Patents on 3D-ICs for Logic and Memory Applications
10/27/2011

IntSim v2.5, an Open-Source 2D and 3D-IC Simulator, Released
09/27/2011

Best of West Finalist, MonolithIC 3D, Inc., Announces Multiple 3D IC Technologies at Semicon West
07/08/2011

Community

MonolithIC 3D Inc. Participated at IP Counsel Café, 2012
05/17/2012

MonolithIC 3D Inc. Advocates Talent-based Recovery of the US Economy
08/18/2011

MonolithIC 3D Inc. Voices Concern that K-12 Science Framework Produces Technology Consumers, Not Technology Creators
08/10/2011