Interconnect Power II 10/03/2011 | Chip Design Magazine Chip Design Magazine's article based on Deepak Sekar's blog post on analyzing Intel’s 22 nm FinFET technology versus a hypothetical planar 22nm CMOS technology.
NCCAVS on 3D Packaging: Bring on the TSVs 06/20/2011 | ElectroIQ Press coverage of MonolithIC 3D Inc.'s presentation at the NCCAVS 3D Packaging Workshop. Presentation discussed our Monolithic 3D DRAM Technology. Available here.
Startup outlines monolithic 3D chips 12/09/2010 | EETimes Press coverage of a MonolithIC 3D Inc. (NuPGA) invited presentation at the 2010 3D-ASIP conference. Presentation discussed approaches to construct monolithic 3D-ICs, and is available here.
ASIC pioneer reinvents 3D FPGAs 01/29/2010 | EETimes Press coverage of a MonolithIC 3D Inc. (NuPGA) invited presentation at the 2010 Applied Materials Technical Symposium on 3D Interconnect. Presentation discussed monolithic 3D FPGA technology. Available here.
How to Create American Jobs 10/03/2011 | The Huffington Post The Huffington Post's article about Zvi Or Bach, CEO at MonolithIC 3D Inc.