IntSim+3D


IntSim+3D is a CAD tool to simulate 2D and 3D-ICs. It models and optimizes
  • Logic gates
  • Signal interconnects in multiple metal levels
  • Power delivery
  • Clock distribution and circuits
  • Heat removal
  • Via blockage
and a whole lot of other phenomena. Slides that summarize this CAD tool's features are here. The IntSim+3D app is available to run/download below. It runs on any computer or platform (Windows, Mac, Unix), and is open-source software. Please let us know if you would like to contribute to the app, and would like to access the source-code.

DOUBLE CLICK on icon below to run or download a beta version of IntSim+3D
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Useful References:
[1] D. C. Sekar, A. Naeemi, R. Sarvari, J. Davis, J. Meindl, "IntSim: A CAD Tool for Optimization of Multilevel Interconnect Networks", Proc. Intl. Conference on Computer Aided Design, pp. 560-567, 2007 (pdf).
[2] Arifur Rahman and Rafael Reif, “System Level Performance Evaluation of Three-Dimensional Integrated Circuits,” IEEE Trans. on VLSI, vol. 8(6), pp 671-678, 2000 (pdf).