IntSim+3D is a CAD tool to simulate 2D and 3D-ICs. It models and optimizes
- Logic gates
- Signal interconnects in multiple metal levels
- Power delivery
- Clock distribution and circuits
- Heat removal
- Via blockage
DOUBLE CLICK on icon below to run or download a beta version of IntSim+3D
 D. C. Sekar, A. Naeemi, R. Sarvari, J. Davis, J. Meindl, "IntSim: A CAD Tool for Optimization of Multilevel Interconnect Networks", Proc. Intl. Conference on Computer Aided Design, pp. 560-567, 2007 (pdf).
 Arifur Rahman and Rafael Reif, “System Level Performance Evaluation of Three-Dimensional Integrated Circuits,” IEEE Trans. on VLSI, vol. 8(6), pp 671-678, 2000 (pdf).