Monolithic 3D-IC is Finally Practical

  A technology breakthrough allows the fabrication of semiconductor devices with multiple tiers of copper connected active devices utilizing conventional  fab equipment. MonolithIC 3D Inc. offers solutions for logic and memory technologies, with significant benefits for cost, power and operating speed. The company believes in collaboration with existing players in the semiconductor industry.

News

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success - Electronisc WeSrch Our latest press release shared by Electronisc WeSrch website.

MonolithIC 3D Inc. Announces its Advisory Board Members - San Francisco Chronicle Our latest press release shared by San Francisco Chronicle.

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success Our latest press release shared by redOrbit website.

MonolithIC 3D Inc. Announces its Advisory Board Members Our latest press release shared by Timesunion website.

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulation Tool a Success Our latest press release about IntSim the 2D and 3D-ICs simulator.

MonolithIC 3D Inc. Announces its Advisory Board Members Our latest press release shared by San Francisco Chronicle.

MonolithIC 3D Inc. Announces its Advisory Board Members Our latest press release shared by Timesunion website.

MonolithIC 3D Inc. Announces its Advisory Board Members Our latest press release shared by Digital Journal website.

MonolithIC 3D Inc. Announces its Advisory Board Members Our latest press release on PRWeb.

Blog: Dimensional scaling and the SRAM bit-cell Our blog post shared by Solid State Technology website.

MonolithIC 3D, Inc.'s Ground-Breaking Technology Receives 30th Patent Info Tech TMCnet article about our latest press release.

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology - Red Orbit Website Our latest press release shared by Red Orbit website.

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology - EE Times India Our latest press release shared by EE Times India website.

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology Our latest press release about the patents issued to MonolithIC 3D Inc.

IEDM 2012: The pivotal point for monolithic 3D ICs Solid State Technology Magazine sharing our latest blog post.

MonolithIC 3D Inc. Shows 3D-ICs Can Be Effectively Cooled Embedded Computing Design Magazine sharing our latest press release.

Moore’s Law seen hitting big bump at 14 nm EE Times sharing our blog post.

Tying up 2012 3D IC Loose Ends 3D InCites blog post about MonolithIC 3D Inc.

MonolithIC 3D Inc. Shows 3D-ICs Can Be Effectively Cooled

IEDM goes deep on 3-D circuits EE Times article about our participation at IEDM.

MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology Our press release was covered by San Francisco Chronicle.

3D Company Updates Our press release was covered by 3D InCites Blog.

Virtual Strategy Magazine: MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology Our press release was covered by Virtual Strategy Magazine

Fox 19 News Website: MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology Our press release was covered by Fox 19 News Website.

ABC 9 KTRE News Website: MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology Our press release was covered by ABC 9 KTRE News Website.

MonolithIC 3D Inc. Granted its 20th Patent on 3D IC Technology Startup now has 17 issued and 3 granted patents in the field of monolithic 3D integrated circuits.

US Patent granted to MonolithIC 3D Inc. on October 09 titled as "Semiconductor and optoelectronic devices" Laser Focus World's article about MonolithIC 3D Inc.

Qualcomm overtakes Intel in market capitalization EE Times sharing our company's latest blog post, the point of view of Zvi O-Bach, Founder and CEO of MonolithIC 3D Inc.

Focus on monolithic 3D-ICs paradigm shift for semicon industry Pradeep Chakraborty's Blog Post about MonolithIC 3D Inc.

MonolithIC 3D Assigned Patent TMCnet.com writing about Monolithic 3D IC's Patents.

Soitec leverages core technologies to address wafer-level 3D integration

Monolithic 3D IC Technologies All Programmable Planet's article about Monolithic 3D ICs technology.

Is the cost reduction associated with IC scaling over? EE Times sharing our blog post about Cost Reduction Associated with Scaling on July 16th, 2012.

SEMICON West 2012 exhibits preview: Lithography focus Solid State Technology Insights for Electronics Manufacturing describing our technology.

Is the Cost Reduction Associated with Scaling Over? Industry Expert Blogs sharing our blog post about Cost Reduction Associated with Scaling on June 21st, 2012.

Embedded Computing Design Selects Top Innovators in Embedded Design Embedded Computing Design's article about Zvi Or-Bach's award.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator - Silicon by Embedded Computing Design Magazine Our press release was covered by State Journal on June 13, 2012.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., Selected as Top Embedded Innovator - Silicon by Embedded Computing Design Magazine Our press release was covered by San Francisco Chronicle on June 13, 2012.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator - Silicon by Embedded Computing Design Magazine Our press release was covered by Fox8 Live website.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., Selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine Our press release was covered by Timesunion.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine Virtual-Strategy Magazine sharing our press release.

2012 Top Embedded Innovator – Silicon: Zvi Or-Bach, Founder and CEO, MonolithIC 3D Designer 3D Glasses sharing the news about Zvi Or-Bach, Founder and CEO of MonolithIC 3D Inc.'s Award.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator – Silicon by Embedded Computing Design Magazine Our press release was covered by Digital Journal on June 13th, 2012.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Top Embedded Innovator - Silicon by Embedded Computing Design Magazine Our press release was covered by 9 and 10 News website.

2012 Top Embedded Innovator - Silicon: Zvi Or-Bach, Founder and CEO, MonolithIC 3D  (Front Cover) Embedded Computing Design's article about Zvi Or-Bach, the Founder and CEO of MonolithIC 3D Inc.

Intel vs. the Foundries: where is advanced logic heading? Industry Expert Blogs sharing our latest blog post.

MonolithIC 3D Inc., a Finalist at Semicon West 2011, Announces its Return to the 2012 Event Our press release was covered by Virtual-Strategy Magazine on May 31st, 2012

MonolithIC 3D Inc., a Finalist at Semicon West 2011, Announces its Return to the 2012 Event Our press release was covered by Digital Journal on May 31st, 2012.

The Future is the Interconnect: IITC Industry Expert Blogs sharing our blog post about IITC on May 21st, 2012

MonolithIC 3D Inc. Participated at IP Counsel Café, 2012 Our press release was covered by San Francisco Chronicle on May 17th, 2012.

Reversal From the Foundry Model Back to IDM? Our blog post was covered by Future Fab Magazine on May, 2012.

Reversal from the foundry model back to IDM ? Our blog post was covered by EE Times on May 11th, 2012.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display Our press release was covered by Digital Journal on April 25th, 2012.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display Our press release was covered by IT Business Net on April 25th, 2012.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display Our press release was covered by The San Francisco Chronicle on April 25th, 2012.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display Our press release was covered by Road Runner Holding's website on April 25th, 2012.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display Our press release was covered by Designer 3D Glasses on April 25th, 2012.

TSV when mass production? Our blog post was covered by EE Times Taiwan on April 13th, 2012.

Viewpoint: Is TSV for real? Our blog post was covered by EE Times on April 9th, 2012.

Is NVIDIA in a Panic? If so, what about AMD? Other fabless companies? Industry Expert Blogs sharing our blog post about NVIDIA on April 2nd, 2012.

Could 3d chip technology extend Moore's law to 2030? Interview for the Next Big Future's website with Zvi Or-Bach, CEO of MonolithIC 3D Inc. on March 30th, 2012

MonolithIC 3D Inc.'s 2D and 3D-ICs Simulator Tool is a Worldwide Hit Our press release was covered in San Francisco Chronicle on March 28th, 2012.

MonolithIC 3D Inc.'s 2D and 3D-ICs Simulator Tool is a Worldwide Hit Our press release was covered in Virtual-Strategy Magazine on March 28th, 2012.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Finalist for EETimes’ Innovator of the Year Award Our press release was covered in an article in Yahoo! News on February 28th, 2012.

MonolithIC 3D Inc. Granted Fundamental Patents on 3D-ICs for Logic and Memory Applications News article about our press release in UAA Today's on February 6th, 2012.

Monolithic 3D: A Basic Primer Press coverage about our technology in 3DIncites's webpage on January 30, 2012.

The Why and How of Fine-Grain 3D Integration Industry Expert Blogs sharing our blog post about Fine-Grain 3D Integration.

Is 3D IC Packaging Ready For Prime Time? Press coverage about our technology in Electronic Design Magazine on December 28, 2011.

Overview of Monolithic 3D Integration solutions for 3D flash memories Press coverage about our monolithic 3d flash memories in I-Micronews on December 13th, 2011.

MonolithIC 3D Issued 5th Patent on 3D IC Technology Our press release was covered in Euroasia Semiconductor Magazine in December, 2011.

Do Foundries Have Too Much Power? Our blog post was covered by the Design and Reuse on December 12th, 2011.

3D Thursday: Is 2.5D IC assembly “buzz-worthy”? Our blog post was covered by the EDA360 Insider blog.

Is the Buzz around Xilinx's 2.5D FPGA Justified? Press coverage about our latest blog post.

What can 20MW Exascale computers teach us about SoC Realization? Steve Leibson's article on our blog post about "The Dally-nVIDIA-Stanford Prescription for Exascale Computing".

3D chips: The next electronics revolution Press coverage about our VP of Technology, Brian Cronquist in Computerworld on Novemeber 2, 2011.

Perspectives on Low Temperature Wafer Direct Bonding for Monolithic 3D Integration Our blog post was covered by Semiconductor Packaging News on October 27th, 2011.

Perfecting the 3-D chip Press coverage about Zvi Or-Bach, CEO of MonolithIC 3D Inc.

The real cost in the move to 450mm wafers Electronics News's article on our blog post about 450nm wafers.

How to Create American Jobs The Huffington Post's article about Zvi Or Bach, CEO at MonolithIC 3D Inc.

Interconnect Power II Chip Design Magazine's article based on our blog post on analyzing Intel's 22 nm FinFET technology versus a hypothetical planar 22nm CMOS technology.

Can 450nm Decommoditize the Semiconductor Industry? Industry Expert Blogs sharing our blog post about 450nm wafers.

Overcoming direct source-drain tunnelling limitations for CMOS transistors Electronics News Australia's cover story of the magazine about our blog post.

Viewpoint: What lies ahead for on-chip interconnect technology? EETimes published our blog post.

Future Horizons forum focuses on 'new rules' EE Times article about The International Electronics Forum. Among the forum's speakers there is Zvi Or-Bach, CEO MonolithIC 3D.

3D ICs without TSVs? Electronic Design News (EDN)'s article about the ion cutting process

MonolithIC 3D Inc. Advocates Talent-based Recovery of the US Economy San Francisco Chronicle's article about our press release.

MonolithIC 3D Inc. Voices Concern that K-12 Science Framework Produces Technology Consumers, Not Technology Creators San Francisco Chronicle's article on our press release.

Viewpoint: Will tri-gate play key role in Intel-ARM tussle? EE Times article about our viewpoint for fabricating three-dimensional ICs which differs from Intel's tri-gate technology.

3D Thursday: The most expensive RAM in the world EDA 360's writeup on our company's monolithically stacked SRAM ideas.

MonolithIC 3D - Best of West Finalist Suggests Scaling "Up" with 3D Semicon West Daily's article on our company.

Events

SEMICON West 2013 July 9th - 11th, 2013 | San Francisco, CA
Join MonolithIC 3D Inc. on July 9th - 11th, 2013 at the Silicon Innovation Forum, SEMICON West 2013 in  Moscone Convention Center, Esplanade Hall, San Francisco, CA. 

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