28nm – The Last Node of Moore's Law
What next? - MonolithIC 3D™ - for cost and power reduction
Breaking news: CEA-Leti signs agreement with Qualcomm to assess monolithic (sequential) 3D technology
A technology breakthrough allows the fabrication of semiconductor devices with multiple tiers of copper connected active devices utilizing conventional fab equipment. MonolithIC 3D Inc. offers solutions for logic and memory technologies, with significant benefits for cost, power and operating speed. The company believes in collaboration with existing players in the semiconductor industry.