Monolithic 3D Inc., the Next Generation 3D-IC Company
  • Home
  • Technology
    • Technology
    • Papers, Presentations and Patents
    • Overview >
      • Background
      • Why Monolithic 3D?
      • Paths to Monolithic 3D
      • Applications
    • Ion-Cut: The Building Block
    • Monolithic 3D Logic >
      • RCAT
      • HKMG
      • Laser Annealing
      • RCJLT
      • 3D Embedded RAM
      • 3D Gate Array
      • FPGA
      • Ultra Large Integration - Redundancy and Repair
    • Monolithic 3D Memory >
      • 3D DRAM
      • 3D Resistive Memories
      • 3D Flash
    • Monolithic 3D Electro-Optics >
      • 3D Image Sensors
      • 3D Micro-Displays
  • 3D-IC Edge
    • 3D-IC Edge
  • News & Events
    • News & Events
    • S3S15 Game Change 2.0 Video/P
    • Webcast
    • Webinar
    • Press Releases
    • In the News
    • Upcoming Events
  • About Us
    • About Us
    • History
    • Team
    • Careers
    • Contact Us
  • Blog
  • Simulators


Why MonolithIC 3D?


For material from our team, please follow this link. A summary is given below:
Picture

A number of research papers have estimated the benefits of 3D over the years:
  • Die Stacking (ED) Microarchitecture - Intel's paper on their effort to simulate a Pentium 4 processor built in 3D.  Their investigation showed that 3D stacking with two stacked die (even with fat TSVs) gave a 54% reduction in power and a 22C reduction in chip temperature for the same performance!
  • Interconnect Limits on Gigascale Integration in the 21st Century - Paper from the groups of Profs. Meindl (Georgia Tech), Reif (MIT) and Saraswat (Stanford). They reported a 3x reduction in die size with four stacked die when monolithic 3D integration is used.
  • Implementing a 2-Gbs 1024-bit ½-rate Low-Density Parity-Check Code Decoder in Three-Dimensional Integrated Circuits - A paper from the Univ. of Washington where they taped out a LDPC decoder in 3D - please see figure below. The improvement in the figure of merit (area*timing*power) is more than 10x.
Picture

© Copyright MonolithIC 3D Inc. , the Next-Generation 3D-IC Company, 2012 - All Rights Reserved, Patents Pending