Global Interconnect Model


IntSim v2 uses two global interconnect levels that are sized to optimize the global signal, power and clock interconnect networks. For 2D-ICs, you would have two fat metal levels in M9/M10 (for example) that perform these global interconnect functions. For 3D-ICs, all the transistor layers share two fat metal levels, as shown in Fig. M9. The equations used in the global interconnect model are described in [25]. A high-level overview of the optimization criteria for the model is shown in Fig. M10.


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            Fig. M9: Schematic showing shared global interconnect levels.                        Fig. M10: High-level description of global interconnect model.