Design and CAD for 3D


  • Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures — [Book] — An excellent book on the topic. From the Amazon description:  "...provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level. [...]covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA, 3D single core/multi core processors, 3D Network-onchip designs."
  • A Study of Through-Silicon-Via impact on the 3D stacked IC layout — This paper appears in Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009.   The authors "propose a new force-directed 3D gate-level placement that efficiently handles TSVs. In addition, they "present an algorithm that assigns TSVs to nets to complete routing that involves TSVs."
  • "3D Integration for NoC-based SoC Architectures — [Book] — From the Amazon description:  "...presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. [...] gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field."
  • UCLA CAD LAB - Guojie Luo  — Summarizes some nice work on CAD tools that have been developed that place circuits/blocks in 3D to minimize total wire length (for example) under the constraint of temperature being <85°C