Case study showing the utility of IntSim v2.0

Case study 1: Comparison of 2D-IC vs. 3D-IC with two device layers
The results of this IntSim v2 study are summarized in the below table. It can be seen that a 3D logic core with two device layers can give a 2x reduction in die size and 2x reduction in power compared to a 2D logic core.

Other case studies: Please refer to ICCAD 2007 paper.