Books on 3D-ICs
With the 3D-IC area moving closer to production, a number of good books on the subject have come out:
Integrated Interconnect Technologies for 3D Nanoelectronic Systems — From the Amazon description: "...this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects."
Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures — [Book] — From the Amazon description: "...provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level. [...]covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA, 3D single core/multi core processors, 3D Network-onchip designs."
Optimal Interconnect Networks for 2D and 3D Microchips — [Book] — Authored by our Chief Scientist, Deepak Sekar Ph.D., this work provides a reference for a variety of topics relevant to interconnects and 3D-ICs, including(from the Amazon description): "...integrated microchannel cooling of 3D stacked dice, repeater insertion models, carbon nanotube interconnects, parallel processing architectures, electromigration avoidance methods and a CAD tool to co-design signal, power, clock and thermal interconnect networks of microchips."
Three Dimensional System Integration: IC Stacking Process and Design — [Book] —From the Amazon description: "...provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain."
Handbook of 3D Integration - [book] - From the Amazon description: "...the editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon, Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others."
Wafer Level 3-D ICs Process Technology — [Book] — From the Amazon description: "...focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs."