3D Technology and Manufacturing
Here is material from our team on the topic:
Below are some research papers:
- IBM Journal of Research and Development's Special Issue on 3D Technology, November 2008 - Has an excellent set of papers devoted to 3D-TSV technology and manufacturing.
- Enabling SOI based assembly technology for 3D-ICs: IBM's classic paper from IEDM 2005 on reducing TSV sizes.
- Laser annealing for dopant activation in Monolithic 3D - Good paper from Stanford University where they used laser annealing for crystallization and dopant activation. With this approach, very-short-wavelength laser beams are required to activate dopants in stacked device layers without over-heating copper interconnect in below layers. The challenge is to avoid pattern sensitivity issues with short-wavelength lasers (that have ~2 orders of magnitude lower wavelength than commercial laser anneal systems). Nevertheless, one of the good papers on implementing monolithic 3D!