Monolithic 3D Inc., the Next Generation 3D-IC Company
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3D Technology and Manufacturing


Here is material from our team on the topic:
Link

Below are some research papers:
  • IBM Journal of Research and Development's Special Issue on 3D Technology, November 2008 - Has an excellent set of papers devoted to 3D-TSV technology and manufacturing.   
  • Enabling SOI based assembly technology for 3D-ICs: IBM's classic paper from IEDM 2005 on reducing TSV sizes.
  • Laser annealing for dopant activation in Monolithic 3D - Good paper from Stanford University where they used laser annealing for crystallization and dopant activation. With this approach, very-short-wavelength laser beams are required to activate dopants in stacked device layers without over-heating copper interconnect in below layers. The challenge is to avoid pattern sensitivity issues with short-wavelength lasers (that have ~2 orders of magnitude lower wavelength than commercial laser anneal systems). Nevertheless, one of the good papers on implementing monolithic 3D!
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