Upcoming Events for MonolithIC 3D Inc.:
ceClub: The Technion Computer Engineering Club
You are invited to attend a lecture by
Zvi Or-Bach
President and CEO, MonolithIC 3D Inc.
A 1,000x Improvement in Computer Systems using Current Fabs and Process
The lecture will take place on Wednesday, 1/11/2017 at 11:30 in room 861
Electrical Eng. Building
Technion City
You are invited to attend a lecture by
Zvi Or-Bach
President and CEO, MonolithIC 3D Inc.
A 1,000x Improvement in Computer Systems using Current Fabs and Process
The lecture will take place on Wednesday, 1/11/2017 at 11:30 in room 861
Electrical Eng. Building
Technion City
CoolCube™/3DVLSI open Workshop
Tuesday, October 17th, 2017
HYATT Regency San Francisco Airport,
1333 Bayshore Highway, Burlingame, CA 94010, USA
This year, Leti and Qualcomm are organizing a CoolCube™/3DVLSI open Workshop dedicated to High Density 3D-IC Technologies including Monolithic 3D Integration (called CoolCube™ Technology at Leti).The workshop is held Tuesday, October 17 at the same location as the IEEE S3S Conference.
Tuesday, October 17th, 2017
HYATT Regency San Francisco Airport,
1333 Bayshore Highway, Burlingame, CA 94010, USA
This year, Leti and Qualcomm are organizing a CoolCube™/3DVLSI open Workshop dedicated to High Density 3D-IC Technologies including Monolithic 3D Integration (called CoolCube™ Technology at Leti).The workshop is held Tuesday, October 17 at the same location as the IEEE S3S Conference.
2017 IEEE S3S Conference
October 16th thru 19th, 2017, Hyatt Regency, San Francisco Airport
S3S Advanced Program
October 16th thru 19th, 2017, Hyatt Regency, San Francisco Airport
S3S Advanced Program
SESSION 18: MONOLITHIC 3D 2, October 18th
18.1 Monolithic Integration of Multiple III-V Semiconductors on Si for Nanoelectronics
Heinz Schmid; IBM Research, Zürich, Switzerland (Invited Speaker)
18.2 GOI fabrication for Monolithic 3D integration A. Abedin, L. Zurauskaite, A. Asadollahi, K. Garidis, G. Jayakumar, B.G. Malm,
P.-E. Hellström* and M. Östling; Department of Electronics KTH Royal Institute of Technology Stockholm, Sweden
18.3 A 1,000x Improvement in Computer Systems by Bridging the ProcessorMemory Gap
Zvi Or-Bach; MonolithIC 3D Inc., San Jose, CA
18.1 Monolithic Integration of Multiple III-V Semiconductors on Si for Nanoelectronics
Heinz Schmid; IBM Research, Zürich, Switzerland (Invited Speaker)
18.2 GOI fabrication for Monolithic 3D integration A. Abedin, L. Zurauskaite, A. Asadollahi, K. Garidis, G. Jayakumar, B.G. Malm,
P.-E. Hellström* and M. Östling; Department of Electronics KTH Royal Institute of Technology Stockholm, Sweden
18.3 A 1,000x Improvement in Computer Systems by Bridging the ProcessorMemory Gap
Zvi Or-Bach; MonolithIC 3D Inc., San Jose, CA
3D TUTORIAL, October 19th
Overview of Monolithic 3D IC Processing
Zvi Or-Bach, MonolithIC 3D Inc.
1. Forming the Silicon Layer: Crystallization, layer transfer
2. Forming Transistors: Modify process, split hot/cold, shield the underlying structure
3. Transfer Yet Align: Smart process, precise bonder, smart alignment
4. Non CMOS Transistors: CNT, mechanical and triode base transistors.
5. New Breakthroughs: Monolithic 3D using current fab process 6. Killer Application: Solving the memory wall
3D TUTORIAL, October 19th
Overview of Monolithic 3D IC Processing
Zvi Or-Bach, MonolithIC 3D Inc.
1. Forming the Silicon Layer: Crystallization, layer transfer
2. Forming Transistors: Modify process, split hot/cold, shield the underlying structure
3. Transfer Yet Align: Smart process, precise bonder, smart alignment
4. Non CMOS Transistors: CNT, mechanical and triode base transistors.
5. New Breakthroughs: Monolithic 3D using current fab process 6. Killer Application: Solving the memory wall
