MonolithIC 3D Technology Licensing
Licensing the Foundations of 3D Integration
MonolithIC 3D Inc. is an inventor-founded semiconductor technology company. Since 2009 we have researched, published, and patented the technologies of scaling up: monolithic and bonded three-dimensional integration. Our record of invention, from the 2011 keynote “Monolithic 3D-ICs: The Effective Alternative to Dimensional Scaling” through the IEEE TENCON 2025 Best Paper Award, is documented on our Record of Invention page. The industry has now broadly adopted this direction across 3D NAND, high-bandwidth memory, and emerging 3D DRAM architectures.
We make our inventions available to the industry through the licensing described below. Our strong preference, stated publicly and consistently, is to license.
We make our inventions available to the industry through the licensing described below. Our strong preference, stated publicly and consistently, is to license.
The Portfolio
"The MonolithIC 3D portfolio comprises more than 400 issued United States patents with many more applications pending and new patents issuing regularly". All patents originate from the company’s own work (no patents were acquired), with foundational priority dates of 2009 to 2010. As the industry has adopted each element of this foundational work, the company has developed domain-specific portfolios, each continuously extended through pending applications. Current domain portfolios include:
Domain categories are not mutually exclusive; a given patent may support more than one category. Patent counts are as of July 2026 and are updated periodically. The complete list of issued patents is available on our Papers, Presentations and Patents page.
- 3D NAND: more than 160 issued US patents
- High-bandwidth memory (HBM): approximately 55 issued US patents covering microbumps-based HBM, plus more than 40 additional issued US patents covering hybrid-bonded HBM
- Hybrid bonding structures and processes: more than 100 issued US patents
- Backside power delivery (power via): more than 20 issued US patents
- 3D image sensors: more than 15 issued US patents
- Additional domains, including 3D electronic design automation and Ultra Scale Integration (multi-die interposer-based systems and devices integrating single-crystal silicon beyond a single reticle), with further domain portfolios in continuous development.
Domain categories are not mutually exclusive; a given patent may support more than one category. Patent counts are as of July 2026 and are updated periodically. The complete list of issued patents is available on our Papers, Presentations and Patents page.
Technology Categories
Licenses are offered by product and technology category, including:
Reserved technologies. Certain technologies, including the company’s 3D NOR architecture, are designated as reserved technologies and are not available under the standard license. Reserved technologies may be made available from time to time through separate arrangements, such as an exclusive license, a joint venture, or another strategic transaction, at the company’s discretion.
- 3D NAND flash structures and methods, including two-wafer architectures in which memory-array and CMOS-periphery wafers are separately fabricated and bonded
- High-bandwidth memory and bonded DRAM stacking, including hybrid-bonded stacks, microbumps stacks, and memory stacked directly on the processor
- Hybrid bonding and oxide bonding structures and processes
- Layer transfer of single-crystal silicon and bonded multilayer device structures
- 3D DRAM device structures and architectures
- Memory-on-logic and processor-plus-memory systems, including near-memory computing architectures
- Power delivery structures, including backside power delivery networks (power via) and connective paths through bonded stacks
- Redundancy, repair, and built-in test for large-scale 3D integration
- Ultra Scale Integration: multi-die interposer-based systems and devices comprising single-crystal silicon layers exceeding a single reticle
- Design automation (EDA) for 3D integrated circuits; 3D image sensors and micro-displays
Reserved technologies. Certain technologies, including the company’s 3D NOR architecture, are designated as reserved technologies and are not available under the standard license. Reserved technologies may be made available from time to time through separate arrangements, such as an exclusive license, a joint venture, or another strategic transaction, at the company’s discretion.
Licensing Principles
- Standard structure. The standard licensing form is a running-royalty license, with rates set by product and technology category.
- Scope. Licenses are available by technology category or across the full portfolio, on a non-exclusive, worldwide basis, and may include patents and applications filed by MonolithIC 3D during the license term.
- Flexible term. Term options include multi-year and life-of-patents structures.
- Coverage for prior periods. Where relevant, a license may include coverage for periods before its effective date.
- Early-licensee recognition. Licensees who engage early receive the greatest flexibility in structure and terms. Licensing terms available to later licensees reflect the circumstances existing at the time of their license.
- Most-favored provisions. Narrowly defined, prospective most-favored-licensee provisions may be available within the same product tier.
How to Engage
Licensing discussions begin with a mutual non-disclosure agreement, under which MonolithIC 3D provides portfolio summaries, representative claim charts, and the current rate schedule. Licenses have been concluded under the portfolio. Inquiries: [email protected]
Legal Notices
This page is a general description of MonolithIC 3D’s licensing and an invitation to open discussions. It is not an offer capable of acceptance, and no license or other right is granted or implied by this page. All licenses are subject to negotiation and execution of a definitive written agreement. Licensing terms and patent counts may change without notice. Nothing on this page is an admission or a statement regarding any pending or contemplated legal proceeding, and nothing on this page constitutes legal advice.