Whenever I discuss 3D with someone, the first question they ask is: Can we really cool these things? Will this technology be useful at all? Thought I should post on the topic...
It's easy to understand why heat removal is an issue for 3D: if you stack two chips of power density PD atop each other, the net power density doubles and becomes 2*PD. Furthermore, one of the chips is far away from the heat sink, making heat removal even more difficult. Several solutions to this problem exist; I'm going to summarize them below.
It's easy to understand why heat removal is an issue for 3D: if you stack two chips of power density PD atop each other, the net power density doubles and becomes 2*PD. Furthermore, one of the chips is far away from the heat sink, making heat removal even more difficult. Several solutions to this problem exist; I'm going to summarize them below.
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