Monolithic 3D Inc., the Next Generation 3D-IC Company
  • Home
  • Technology
    • Technology
    • Papers, Presentations and Patents
    • Overview >
      • Background
      • Why Monolithic 3D?
      • Paths to Monolithic 3D
      • Applications
    • Ion-Cut: The Building Block
    • Monolithic 3D Logic >
      • RCAT
      • HKMG
      • Laser Annealing
      • RCJLT
      • 3D Embedded RAM
      • 3D Gate Array
      • FPGA
      • Ultra Large Integration - Redundancy and Repair
    • Monolithic 3D Memory >
      • 3D DRAM
      • 3D Resistive Memories
      • 3D Flash
    • Monolithic 3D Electro-Optics >
      • 3D Image Sensors
      • 3D Micro-Displays
  • 3D-IC Edge
    • 3D-IC Edge
  • News & Events
    • News & Events
    • S3S15 Game Change 2.0 Video/P
    • Webcast
    • Webinar
    • Press Releases
    • In the News
    • Upcoming Events
  • About Us
    • About Us
    • History
    • Team
    • Careers
    • Contact Us
  • Blog
  • Simulators

DARPA calls for Monolithic 3D – 3DSoC

9/20/2017

0 Comments

 
Picture
               We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc.
​               Learn all about Monolithic 3D at IEEE S3S.


On Sept 13 DARPA come out with Electronic Resurgence Initiative (ERI) programs. Quoting: “with an eye toward the times we now live in, [Gordon Moore] laid out the technical directions to explore when the conditions under which scaling will be the primary means for advancement are no longer met. A trio of simultaneously-released ERI BAAs—this one among them—parallel the research areas detailed on page three of Moore’s paper: materials and integration, architecture, and design. These new page-three-inspired investments, along with a series of related investments from the past year, comprise the overall Electronics Resurgence Initiative.”  

Among these programs is the “Three Dimensional Monolithic System-on-a-Chip (3DSoC): Develop 3D monolithic technology that will enable > 50X improvement in SoC digital performance at power.”

In perfect timing, this year’s IEEE S3S 2017 at the Hyatt Regency at the San Francisco Airport will feature a comprehensive show case for monolithic 3D IC technologies.

At the start Al Fazio, Intel Senior Fellow, will give a plenary talk on how 3D NAND and 3D XPoint™ happened to be the trailblazing monolithic 3D IC technologies that have matured to volume production, taking over the fast growing memory market. The first day will end with two 3D IC focus sessions comprised of a mix of invited and submitted papers covering exotic technologies and the use of the emerging nano-wire transistor for 3D scaling.

The first half of the second day includes a collaborative event organized by Qualcomm and CEA Leti – the COOLCUBE/3DVLSI Open Workshop. The second half will include an open 3D tutorial providing full coverage of the various 3D integration technologies from TSV to Sequential Integrations. 

The third day of the conference will include a full day with four sessions of invited and submitted talks on monolithic and other forms of 3D integration. These sessions will include a talk by us, MonolithIC 3D Inc., in which we will present a monolithic 3D technology that is ready to be rapidly deployed using the current transistor process. In that talk we will also describe how such an integration technology could be used to improve performance, reduce power and cost of most computer systems, suggestive of a 1,000x total system benefit.

In addition, the IEEE S3S conference will have full coverage of SOI and low power technologies, making it the place to be and to learn about alternative technologies to dimensional scaling. I am looking forward to seeing you at the S3S from October 16th thru 19th, 2017.
submit to reddit
0 Comments

    Search Blog


    Meet the Bloggers


    Follow us


    To get email updates subscribe here:


    Recommended Links

    3D IC Community
    3D IC LinkedIn Discussion Group

    Recommended Blogs

    • 3D InCites by Francoise von Trapp
    • EDA360 Insider by Steve Leibson
    • Insights From the Leading Edge by Phil Garrou
    • SemiWiki by Daniel Nenni, Paul Mc Lellan, et al.

    Archives

    July 2024
    January 2024
    December 2023
    May 2023
    March 2022
    December 2021
    August 2021
    August 2018
    July 2018
    May 2018
    October 2017
    September 2017
    December 2016
    September 2016
    August 2016
    November 2015
    October 2015
    September 2015
    July 2015
    June 2015
    May 2015
    April 2015
    March 2015
    February 2015
    October 2014
    September 2014
    August 2014
    July 2014
    June 2014
    May 2014
    April 2014
    March 2014
    February 2014
    January 2014
    December 2013
    November 2013
    October 2013
    September 2013
    August 2013
    July 2013
    March 2013
    February 2013
    January 2013
    December 2012
    November 2012
    October 2012
    August 2012
    June 2012
    May 2012
    April 2012
    March 2012
    February 2012
    January 2012
    December 2011
    November 2011
    October 2011
    September 2011
    August 2011
    July 2011
    June 2011
    May 2011
    April 2011
    March 2011

    Categories

    All
    3d Design And Cad
    3d Ic
    3dic
    3d Nand
    3d Stacking
    3d Technology
    Brian Cronquist
    Dean Stevens
    Deepak Sekar
    Dram
    Education
    Heat Removal And Power Delivery
    Industry News
    Israel Beinglass
    Iulia Morariu
    Iulia Tomut
    Monolithic 3d
    Monolithic3d
    Monolithic 3d Inc.
    MonolithIC 3D Inc.
    Monolithic 3d Technology
    Moore Law
    Outsourcing
    Paul Lim
    Repair
    Sandisk
    Semiconductor
    Semiconductor Business
    Tsv
    Zeev Wurman
    Zvi Or Bach
    Zvi Or-Bach

    RSS Feed

Powered by Create your own unique website with customizable templates.