We have a guest contribution today from Israel Beinglass, the CTO of MonolithIC 3D Inc. Israel talks about the use of monolithic 3D integration for SRAM stacking above/below logic.
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We have a guest contribution today from Israel Beinglass, the CTO of MonolithIC 3D Inc. Israel talks about the use of monolithic 3D integration for SRAM stacking above/below logic.
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 We have a guest contribution today from Israel Beinglass, the CTO of MonolithIC 3D Inc. Israel was at Applied Materials for almost two decades, and served as Chief Technology Officer and Chief Marketing Officer for many groups there. In this blog-post, Israel discusses an interesting trend he sees in the semiconductor industry today.
 We have a guest contribution today from Israel Beinglass, the CTO of MonolithIC 3D Inc. Israel was an executive at Applied Materials for many years, and is considered one of the leading industry experts in epi technology. He served as a board member at SiGen in the late 1990s (for those who are not familiar with SiGen, it was one of the first companies that worked on ion-cut technology). In this post, Israel discusses and compares different techniques to obtain stacked monocrystalline semiconductor layers.
 We have a blog post today from Israel Beinglass, the CTO of MonolithIC 3D Inc. Israel spent almost 20 years at Applied Materials, and was Chief Technology Officer, Chief Marketing Officer and General Manager at various divisions there. Israel gives us a "fab-equipment perspective" on Monolithic 3D technology.
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