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Believe it or not, the answer is "TRUE"!  Who did it? It was Matrix Semiconductor, a Silicon Valley startup, who shipped the world's first monolithic 3D products in 2003. These were One-Time Programmable (OTP) non-volatile memory chips that had multiple layers of polysilicon diodes in series with antifuses. See picture alongside.
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Paul McLellan made an interesting series of posts over on his edagraffiti blog a while back. If you're interested in the EDA perspective on 3D ICs, you should go check them out. You probably should go read them just because Dr. McLellan is a great writer who always adds value with his observations. His list of relevant posts includes:
EETimes had a nice report on the recent International Symposium on Physical Design (ISPD), held March 27-30, 2011 in Santa Barbara, CA. For our purposes, the particularly interesting bits were:
There are a couple of interesting meetings coming up in the next several weeks that highlight one of the questions that has been lurking around the 3D movement for as long as I can remember. One group, that is well represented by the discussion at these meetings, sees 3D as a packaging issue. Perhaps that's why the IEEE CPMT-SV is such an active sponsor of these discussions:
Transistor = Bardeen, Brattain & Shockley; IC = Kilby & Noyce; DRAM = Dennard; Flash = Masuoka; 3D Stacking = Who??
3D stacked integrated circuits are on the roadmaps of most logic, flash and DRAM vendors today. In 10 years time, we will have seen widespread adoption of this technology. Shouldn’t we know who invented or talked about 3D Stacking first? After all, this technology is going to have a huge impact on our lives… |
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